SMT, PCB Electronics Industry News

IPC Releases PCB Industry Results For June 2011

Jul 27, 2011

Trends in the Book-to-Bill Ratio for Rigid PCBs

Trends in the Book-to-Bill Ratio for Rigid PCBs

Trends in the Book-to-Bill Ratio for Flexible Circuits

Trends in the Book-to-Bill Ratio for Flexible Circuits

Trends in the Book-to-Bill Ratio for Rigid PCBs and Flexible Circuits Combined

Trends in the Book-to-Bill Ratio for Rigid PCBs and Flexible Circuits Combined

Rigid and Flexible PCB Shipments Year-on-Year Growth Rates

Rigid and Flexible PCB Shipments Year-on-Year Growth Rates

IPC - Association Connecting Electronics Industries® announced today the June findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

PCB Industry Growth Rates and Book-to-Bill Ratios Announced

Rigid PCB shipments were up 5.4 percent and bookings down 7.3 percent in June 2011 from June 2010. Year to date, rigid PCB shipments increased 4.4 percent and bookings declined 8.9 percent. Compared to the previous month, rigid PCB shipments increased 15.3 percent and rigid bookings increased 10.4 percent. The book-to-bill ratio for the North American rigid PCB industry in June 2011 was slightly below parity at 0.98.

Flexible circuit shipments in June 2011 were down 5.9 percent and bookings grew 30.8 percent compared to June 2010. Year to date, flexible circuit shipments increased 10.1 percent and bookings also increased 10.1 percent. Compared to the previous month, flexible circuit shipments increased 4.7 percent and flex bookings climbed by 21.9 percent. The North American flexible circuit book-to-bill ratio in June 2011 jumped to 1.13.

For rigid PCBs and flexible circuits combined, industry shipments in June 2011 increased 4.4 percent from June 2010, as orders booked decreased 4.2 percent from June 2010. Year to date, combined industry shipments were up 4.8 percent and bookings were down 7.3 percent. Compared to the previous month, combined industry shipments for June 2011 increased 14.4 percent and bookings increased 11.5 percent. The combined (rigid and flex) industry book-to-bill ratio in June 2011 reached parity at 1.00.

 “The industry’s book-to-bill ratio has returned to parity due to unusually high growth in flexible circuit orders in June,” said IPC President & CEO Denny McGuirk. “This indicates strong sales in the flex segment over the next several months. Rigid PCB sales growth is still positive but trending downward due to weaker orders.”

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next two to three months.

Book-to-bill ratios and growth rates for rigid PCBs and flexible circuits combined are heavily affected by the rigid PCB segment. Rigid PCBs represent an estimated 89 percent of the current PCB industry in North America, according to IPC’s World PCB Production Report.

The Role of Domestic Production

IPC’s monthly survey of the North American PCB industry tracks bookings and shipments from U.S. and Canadian facilities, which provide indicators of regional demand. These numbers do not measure U.S. and Canadian PCB production. To track regional production trends, IPC asks survey participants for the percent of their reported shipments that were produced domestically (i.e., in the USA or Canada). In June 2011, 78 percent of total PCB shipments reported were domestically produced. Domestic production accounted for 78 percent of rigid PCB and 79 percent of flexible circuit shipments in June by IPC’s survey participants. These numbers are significantly affected by the mix of companies in IPC’s survey sample, which change slightly in January, but are kept constant through the remainder of the year.

Bare Circuits versus Assembly

Flexible circuit sales typically include value-added services such as assembly, in addition to the bare flex circuits. In June, the flexible circuit manufacturers in IPC’s survey sample indicated that bare circuits accounted for about 48 percent of their shipment value reported for the month. Assembly and other services make up a large and growing segment of flexible circuit producers’ businesses. This figure is also sensitive to changes in the survey sample, which may occur at the beginning of each calendar year.

Interpreting the Data

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they may reflect cyclical effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month may not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The information in IPC’s monthly PCB industry statistics is based on data provided by a representative sample of both rigid and flexible PCB manufacturers in the USA and Canada. IPC publishes the PCB Book-to-Bill Ratio and the PCB Statistical Program Report each month. Statistics for the previous month are not available until the last week of the following month.


IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,900 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 18, 2017 -

Excel Electronics, Inc. Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing

Sep 18, 2017 -

IPC Disappointed by Failure of Negotiated Rulemaking Aimed at Encouraging Recycling of Manufacturing Byproducts

Sep 12, 2017 -

IPC Joins Industry Coalition in Support of U.S. EPA in Litigation over Chemical Safety Act

Sep 11, 2017 -

IPC APEX EXPO 2018 Opening Keynote from Jared Cohen Will Highlight Technology’s Game Changers

Sep 07, 2017 -

Wage and Salary Survey Deadline for North American Electronics Assembly Industry Extended to September 29

Sep 07, 2017 -

IPC Praises Federal Court Decision to End Overtime Rule

Sep 06, 2017 -

Grupo Mirgor First Company in South America to Earn Certification as Qualified Manufacturer to IPC-J-STD-001/610 Recognized as IPC-Trusted Source and QML-Listed

Sep 03, 2017 -

North American PCB Orders Up, Sales Down, Raising Book-to-Bill Ratio

850 more news from Association Connecting Electronics Industries (IPC) »

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

Sep 19, 2017 -

BTU Introduces Profile Guardian Redundant Process Monitor during SMTAI

Sep 19, 2017 -

ADLINK Technology Showcasing Latest Rugged Embedded Railway Solutions at Major European Railway Exhibitions TRAKO, Expo Ferroviaria and Nordic Rail

See electronics manufacturing industry news »

IPC Releases PCB Industry Results For June 2011 news release has been viewed 644 times

HeatShield Gel- thermal PCB shield during reflow

Precision Auger Dispense Pump