SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from DEK International


DEK partners with OKI to introduce breakthrough technologies at first Advanced SMT Processes and Applications Seminar in Chengdu

Jul 22, 2011

ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be printed using a conventional stencil printing process with a single thickness stencil.

ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be printed using a conventional stencil printing process with a single thickness stencil.

Nano-ProTek is an easily applied, stencil coating technology that renders the stencil surface ‘fluxophobic’. It increases cleaning effectiveness and reduces cleaning frequency.

Nano-ProTek is an easily applied, stencil coating technology that renders the stencil surface ‘fluxophobic’. It increases cleaning effectiveness and reduces cleaning frequency.

DEK, the world’s leading mass imaging equipment supplier, introduced two breakthrough technologies, ProActiv and Nano-ProTek stencil coating, to customers in Chengdu last week. 

These latest cutting-edge technologies and application processes, in addition to LGA/QFN rework, were presented at the first Advanced SMT Processes and Applications Seminar 2011 in Chengdu.  The rapid development of the electronics industry in the Sichuan Province has already attracted many major manufacturers in the industry, making it an emerging and promising market for surface mount technology equipment suppliers.

Jointly organized and presented by DEK and OK International (OKI), the seminar attracted more than 100 participants and over 50 company delegates from Chengdu, Chongqing, Mianyang and neighboring regions.  Attendees hailed from many different sectors including electronic manufacturing services, telecommunications and automobile electronics. 

“The electronics industry has been developing quickly in Chengdu, with many large corporations establishing their foothold here,” said Mr. Allen Huang, DEK’s General Manager of Greater China. “Customers can now leverage our expertise, experience and innovative ProActiv and Nano-ProTek technologies to improve the yield and efficiency of their operations.  This seminar is the first such endeavor in Chengdu and we look forward to hosting future similar events in this region to support our growing customer base.”

ProActiv is a breakthrough process technology designed to enable electronics manufacturers to increase miniaturization by rewriting the area ratio rules that limit conventional printing with smaller stencil apertures. It facilitates the ability for next-generation components to be printed alongside standard components, using only a conventional printing process with a single thickness stencil. This is particularly ideal for manufacturers dealing with high-density heterogeneous boards and ultra-fine pitch assemblies.

Also highlighted at the seminar was DEK’s groundbreaking Nano-ProTek ‘fluxophobic’ stencil coating. This unique technology has the ability to increase cleaning effectiveness while reducing cleaning frequency to drive unprecedented first-pass yield.  Its simple wipe-on application is quick and easy and delivers a major advantage in production.  

Earlier this year, ProActiv won the EM Asia Innovation and the SMT Vision Awards in China, while Nano-ProTek also won the SMT Vision Award in China and the NPI Award during APEX in the United States.


DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production.

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