SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Jul 20, 2011

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 8th Annual International Wafer-Level Packaging Conference.  The IWLPC will be held October 3-6, 2011 at the Santa Clara Marriott Hotel in Santa Clara, California.  Registration is now available on-line and Early Bird conference pricing is in effect until September 2, 2011, after which registration prices will go up $100.

Attendees will benefit by gaining the latest knowledge with eight application-oriented tutorials, 10 technical sessions, two expert panel discussions, and a keynote presentation from distinguished speaker Raj Master, General Manager, Microsoft Hardware Silicon, Packaging, Quality and Reliability, titled "Thermal and Power Considerations in Electronics Packaging."

The conference includes three tracks with two days of technical paper presentations covering: Wafer Level Packaging; 3-D (Stacked) Packaging; and MEMS Packaging.

Exhibit space is limited but there are still tabletop spaces available. Please contact Seana Wall, seana@smta.org, at SMTA or any sales representative with Chip Scale Review at info@chipscalereview.com with questions or for more information about the exhibition.

This premier industry event explores leading-edge design, material, and process technologies focused on Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer-level packaging solutions for integration, cost, and performance requirements.

Visit http://www.iwlpc.com for more information.
Contact Patti Hvidhyld at 952-920-7682 or patti@smta.org with questions.


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Chip Scale Review, now entering its 15th year, is the leading international magazine serving the semiconductor, IC and electronic device packaging market.

May 13, 2018 -

SMTA/CALCE Announce Program for Symposium on Counterfeit Parts and Materials

May 06, 2018 -

SMTA Capital Chapter to Host Chapter Meeting

Apr 24, 2018 -

iNEMI Co-Hosts Automotive Session at SMTA Europe’s Electronics in Harsh Environments Conference

Apr 22, 2018 -

SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab

Apr 18, 2018 -

SMTA Europe's Harsh Environments Conference Session 6 to Focus on Automotive Electronics

Apr 17, 2018 -

International Conference for Electronics Enabling Technologies (ICEET) Program Finalized

Apr 16, 2018 -

Session 5 to Focus on Adhesives/Coatings at SMTA Harsh Environments Conference

Apr 15, 2018 -

Electrochemical Reliability Is the Focus of Session 4 at SMTA Europe's Harsh Environments

Apr 11, 2018 -

SMTA Europe's Harsh Environments Conference Session 3 to Focus on Advanced Test

Apr 09, 2018 -

Session 2 of SMTA Europe's Harsh Environments Conference to Focus on Reliability

598 more news from Surface Mount Technology Association (SMTA) »

May 21, 2018 -

Naprotek, Inc. Installs Flexible New MXI System

May 21, 2018 -

Ersa Holds National Sales Meeting with Hands on Training

May 21, 2018 -

New Lightweight Cartridge Applicators from Techcon

May 21, 2018 -

KIC to Discuss Closing the Loop at SMT/Hybrid/Packaging

May 21, 2018 -

Ventec International Group Awarded IPC-4101/40 Qualified Products Listing Certification

May 21, 2018 -

Packaging Materials Market to grow at 3% CAGR over 2018-2024

May 20, 2018 -

BTU to Show PYRAMAX and Profile Guardian at SMT/Hybrid/Packaging

May 20, 2018 -

Viscom Presents Advanced Inspection Solutions for ‘Smart Factory’ at SMT Hybrid Packaging 2018

May 20, 2018 -

MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2018

May 20, 2018 -

SHENMAO America to Participate in the eSMART Factory Conference

See electronics manufacturing industry news »

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open news release has been viewed 1247 times

  • SMTnet
  • »
  • Industry News
  • »
  • International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open
Ecolloy Soldering Alloy

Software for SMT