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ZESTRON to Exhibit ATRONR AC 207 at the SMTA's Ohio Valley Expo and Tech Forum

Jul 14, 2011

Before cleaning with ATRON® AC 207 - residues visible around solder joints.

Before cleaning with ATRON® AC 207 - residues visible around solder joints.

No residues visible after cleaning with ATRON® AC 207, at 15% concentration.

No residues visible after cleaning with ATRON® AC 207, at 15% concentration.

ZESTRON, the worldwide leading provider of high precision cleaning products and services for the electronics manufacturing industry, will exhibit ATRON® AC 207 as well as the company’s complete line of process solutions at the SMTA’s Ohio Valley Expo & Tech Forum held at the Doubletree Hotel, 6200 Quarry Lane, Independence, OH on July 14, 2011.  Show hours are from 9:30 am to 3 pm.

ATRON® AC 207 is a FAST® Technology-based surfactant PCB cleaner, specifically designed to provide a superior level of material compatibility with sensitive metals. With a bath life that is 3 to 10 times longer than that of traditional surfactants, ATRON® AC 207 offers excellent cleaning results in high and medium pressure inline as well as batch cleaning systems at low concentrations and temperatures.  It removes a wide variety of the latest lead-free and eutectic flux residues as well as unsoldered solder pastes.

For more information about ATRON® AC 207 as well as ZESTRON’s complete line of products and services, please visit ZESTRON’s tabletop exhibit. Our sales and engineering team stands ready to answer any questions you may have.  To register for the expo and tech forum, please visit http://www.smta.org/expos/#oh.


Headquartered in Manassas, Virginia and operating in over 35 countries, ZESTRON is the leading global provider of precision cleaning products and services. For over 20 years, ZESTRON has created products to help its customers achieve success. Today, with the largest team of chemical engineers in the industry, ZESTRON leverages comprehensive capabilities to ensure customers surpass even the most stringent cleaning and vapor recovery requirements.

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