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Expanded Roadmap Track Announced For 2012 Pan Pacific Symposium

Jul 14, 2011

SMTA is pleased to announce the expansion of the International Electronics Industry Roadmap track at the 2012 Pan Pacific Microelectronics Symposium at the Sheraton Poipu Resort in Kauai, HI, 14-16 February.

This series of sessions includes roadmap reviews from the ITRS, iNEMI, IPC, JIEP and others as well as select individual corporate roadmaps.  Sessions further incorporate workshop discussions of the issues related to the individual session topics.  As an additional benefit, participants receive summarized results of the sessions and workshops prepared by expert session reporters.

Session topics focus on:

  • Chip Packaging (SiP, PoP,3D, TSV, MEMS, etc.)
  • Interconnect Structures (PWBs, interposers, substrates, embedded components, etc.)
  • Electronics Assembly (Advanced SMT, PoP, W2W, C2W, etc.)
  • Optical Systems (backplanes, amplifiers, repeaters, etc.)

Sessions include market assessments supplementing technology roadmaps and provide  additional perspectives.

Response to the Pan Pacific 2011 Roadmap Session encouraged SMTA to greatly expand the 2012 Roadmap program into a Global Summit on Electronics Industry Roadmaps.  Invited speakers include developers of the ITRS, iNEMI, IPC, and JIEP roadmaps as well as several company and application-specific roadmaps.  The Pan Pacific 2012 Technical Committee continues to seek additional Roadmap contributors to compliment the sessions and topics above.  Abstracts are due July 29, 2011.

Visit http://smta.org/panpac/ or contact SMTA at 952-920-7682 for more information about Pan Pacific 2012 or to submit an abstract for either the Roadmap sessions described above or other Pan Pacific topics.


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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