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AIMS Harsh Environments Symposium To Address Thermo-Mechanical Analysis, Metallization, and Reliability of Lead-Free Solders

Jul 14, 2011

The SMTA announced that the AIMS Harsh Environments Symposium will be held on October 17, 2011 as a focused symposium at SMTA International in Ft. Worth, TX. 

The AIMS Harsh Environments Symposium addresses the concerns related to harsh environment electronics and the challenges within the electronics community, with an added emphasis on military and space.  It is intended to bring together the needs of “end-users” with the capabilities of the research community and the industrial supply base. Specifically, the Symposium addresses the challenges of meeting expanding temperature ranges (-55C to +150C/+200C) with increased vibration, higher package density and longer reliability.

The AIMS Harsh Environments Symposium topics include:

  • Thermo-Mechanical Analysis and Prognostics of Lead-Free Solders,
  • Metallization and Connector Failure Mechanisms,
  • Lead-Free Component and Solder Joint Reliability Testing,
  • Reliability of SAC Solder Joints. 

Papers will be presented by speakers from IBM, Celestica, Intel, and Alcatel-Lucent among others. 

Two international papers as well as three university papers help to round out the program.  The Harsh Environments Keynote Lunch will feature Anthony Rafanelli, Ph.D., P.E., Raytheon Integrated Defense Systems, presenting "How the Defense/Aerospace Industry is Responding to the Lead-Free Challenge."

Details of the AIMS Harsh Environments Symposium can be found at http://www.smta.org/smtai/symposium.cfm#he or contact SMTA administrator JoAnn Stromberg: 952-920-7682 or joann@smta.org.


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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