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ACD Holds Annual “Controlled Burn” at New Expanded Facility

Jun 24, 2011

ACD (Automated Circuit Design), a leading supplier to the electronics industry, held its annual “controlled burn” barbecue on Friday, June 17, 2011 to thank the Richardson Fire Department for putting out its “uncontrolled burn” eight years ago. Since the burn, the company has built a new, expanded facility in addition to expanding its staff.

On June 19, 2003, an electrical fire burned through ACD’s facility, leaving the company in $2 million worth of ashes. Since the fire, ACD employees have hosted an annual “controlled burn” barbecue every June. “The fire department did an incredible job,” said ACD president and CEO W. Scott Fillebrown. “They are a group that we as a society take for granted. We try hard to let them know we will never forget what they did for our company.”

Immediately after the Thursday night fire, ACD employees and their friends and family members worked through the weekend to move operations to a temporary facility where they resumed operations Monday morning. Fillebrown explained that many clients never noticed a disruption in service.

Since the “uncontrolled burn” in 2003, ACD has seen continued growth in revenues each year. During the past year, it added 13,500 ft2 to its facility in Richardson and hired 50 new employees. ACD came back from the burn stronger than ever and Fillebrown is thankful to his employees for that. “Without them we would not be here,” he said. “I think many companies would lose their employees out of fear for survival. We lost none — in fact we gained some.”

Today, ACD is a leading supplier to the electronics industry. Founded in 1984, ACD’s services comprise complete board layout services, ATE engineering services, DFM/DFA capability, printed circuit fabrication, component procurement, SMT and through-hole build, rework, X-ray, flying probe and functional test, and development.


Founded in 1984, ACD’s services comprise complete board layout services, ATE engineering services, DFM/DFA capability, printed circuit fabrication, component procurement, SMT and thru-hole mixed technology assembly, box build, rework, X-Ray, flying probe and functional test, and development.

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