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CyberOptics to Showcase Its Latest Inspection Solutions at NEPCON Thailand 2011

Jun 16, 2011

CyberOptics’ innovative QX500™ AOI system is designed with a unique image acquisition solution – Strobed Inspection Module (SIM).

CyberOptics’ innovative QX500™ AOI system is designed with a unique image acquisition solution – Strobed Inspection Module (SIM).

SE350™ in-line SPI system is equipped with CyberOptics’ calibration-free 3D sensor technology to inspect even the most demanding assemblies

SE350™ in-line SPI system is equipped with CyberOptics’ calibration-free 3D sensor technology to inspect even the most demanding assemblies

CyberOptics Corporation (Nasdaq: CYBE), a leading SMT inspection solutions provider, announces that it will feature its multiple award-winning QX500™ AOI system and robust SE350™ in-line SPI system at the upcoming NEPCON Thailand, scheduled to take place June 23-26, 2011 at the Bangkok International Trade & Exhibition Centre (BITEC) in Bangkok. CyberOptics’ representative in Thailand and partner for the show, WKK, invites all attendees to visit Booth B501 for a firsthand demonstration of CyberOptics’ latest inspection systems.

CyberOptics’ innovative QX500™ AOI system is designed with a unique image acquisition solution ― Strobed Inspection Module (SIM) ― bringing forth yet another industry-leading, high-speed inspection solution matched with exceptional defect coverage and an extremely low false call rate.

The introduction of strobed white lighting in the QX500™ makes it the only AOI system to provide ‘on-the-fly’ area-scanning inspection at an incredible 200 cm²/sec, setting it apart from other conventional AOI systems. The QX500™’s dual fixed-angle lighting provides superb image quality for advanced automated inspection of solder and lead defects, presence and position, correct part and polarity for inspection down to 01005 components.

SE350™ is the latest addition to CyberOptics’ 3-D solder paste inspection system portfolio. The simple and robust SE350™ is equipped with CyberOptics’ calibration-free 3D sensor technology to inspect even the most demanding assemblies. The sensor is an integrated assembly designed with no moving parts, eliminating machine-to-machine variation across production lines while offering the lowest cost of ownership in the industry. Leveraging on development efforts of the SE500™, this system is capable of inspecting pad sizes down to 01005 component size (150 x 150 μm).

For further information, visit CyberOptics in booth B501 at NEPCON Thailand 2011 or the Web at www.cyberoptics.com.


Founded in 1984, CyberOptics is a recognized leader in process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. Headquartered in Minneapolis, MN, CyberOptics conducts operations in North America, Asia and Europe.

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