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LPKF Introduces New Laser for Depaneling

Jun 07, 2011

The MicroLine 1000 S laser system presents a compact, cost-effective method for UV-laser depaneling of thin-rigid and rigid-flex assembled PCBs

The MicroLine 1000 S laser system presents a compact, cost-effective method for UV-laser depaneling of thin-rigid and rigid-flex assembled PCBs

LPKF, a leading manufacturer of laser and electronic systems, announces that it has added another laser system to its repertoire. The MicroLine 1000 S presents a compact, cost-effective method for UV-laser depaneling of thin-rigid and rigid-flex assembled PCBs.

Dr. Ingo Bretthauer, CEO and Chairman of LPKF, commented, “The MicroLine 1000 S combines a low entry-level price with the highest cutting quality and superior process capabilities. Additionally, it is extremely flexible and, therefore, suited for high manufacturing variance. We are using a laser source that was optimized just for this application.”

With UV-laser cutting of assembled and/or unassembled PCBs, those with limited space will benefit. The UV laser beam can cut along delicate components or circuit paths without mechanical or thermal interference. The tool-less method makes any contour possible. Changes to the cutting paths are made by programming the software included with the machine or directly in the CAD software.


LPKF Laser & Electronics is the world leading manufacturer of both mechanical and laser systems for demanding tasks in printed circuit board technology and microelectronics. LPKF’s worldwide headquarters is located in Garbsen, Germany outside of Hannover and the company maintains North American headquarters in Portland, OR.

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