SMT, PCB Electronics Industry News

PRESS RELEASE: IPC APEX is 2 Weeks Away!

Feb 08, 2018

(Albany, NY) 2/6/2018 – IPC APEX EXPO is just two weeks away! The trade show will take place at the San Diego Convention Center, in San Diego, CA, from February 27th to March 1st, 2018. YINCAE hopes you will stop by our booth # 2732, to learn more about YINCAE and the innovative products we have to offer.

YINCAE Advanced Materials offers innovative and premier products including: adhesives, thermal interface materials (TIM1/TIM2), board/package/wafer level materials, and coatings; many of which have been implemented by leading semiconductor manufacturers and Tier 1 microelectronic suppliers. YINCAE continues to exceed customer expectations and develop solutions for flip chip, CSP, BGA, POP, LGA, and many more applications. YINCAE hopes to see you at the exhibition!

To schedule a meeting with the YINCAE team during the exhibition, please email us at: info@yincae.com with a brief description of the meeting topic. You can also find more information by visiting our website at: www.yincae.com

* * * * * * * * * *

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

 ###

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

May 18, 2018 -

YINCAE’S SMT 158A Receives High Praise

May 14, 2018 -

YINCAE’S New Highly Conductive Thermal Underfill: SMT 158D

May 08, 2018 -

SEMICON WEST 2018 is in 1 Month! VISIT YINCAE BOOTH 5269

Apr 09, 2018 -

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Mar 30, 2018 -

SEMICON West is 3 months away! Visit YINCAE at Booth #5269

Feb 14, 2018 -

Press Release: DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

Feb 14, 2018 -

Press Release: DA 90 Low Temperature Die Attach Adhesive Series Materials

Feb 14, 2018 -

Press Release: YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

Jan 16, 2018 -

Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160

Jan 16, 2018 -

Press Release: Low Temperature Reflowable Underfill Material: SMT 160L

24 more news from YINCAE Advanced Materials, LLC. »

Jun 21, 2018 -

New Applicator Guns from Techcon at Farnborough International Airshow

Jun 21, 2018 -

IPC’s PCB Technology Trends Study Underway, PCB Fabricator Survey Open Until July 13

Jun 21, 2018 -

YXLON International to Host Three Open House Events at Its Lab One Facility

Jun 21, 2018 -

ROSIN RESINS FOR SOLDERING SOLUTION

Jun 20, 2018 -

ECO-FRIENDLY MEETS HIGH-TECH – Product Launch at Nepcon Thailand

Jun 20, 2018 -

KYZEN Sees Growth in Asia & Expands Marketing Support

Jun 20, 2018 -

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Jun 20, 2018 -

Inspection Services Labs in San Jose and Ohio Now Fully Equipped with Non-Destructive Testing Technology

Jun 20, 2018 -

VJ Electronix Promotes Frank Cosentino to Western Regional Sales Manager for the Americas

Jun 20, 2018 -

Scienscope Expands Partnership with Restronics

See electronics manufacturing industry news »

PRESS RELEASE: IPC APEX is 2 Weeks Away! news release has been viewed 7 times

Fast PCB Assembly

Used SMT Equipment