SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • IMAPS 2017 is Next Week VISIT YINCAE BOOTH # 416 Join Dr. Yin’s Presentation October 10th at 2:30 PM Room 305A

IMAPS 2017 is Next Week VISIT YINCAE BOOTH # 416 Join Dr. Yin’s Presentation October 10th at 2:30 PM Room 305A

Oct 02, 2017

(Albany, NY) 10/02/2017 –  IMAPS 2017 is one week away. The tradeshow will take place at the Raleigh Convention Center in Raleigh, NC.  October 10th & 11th, 2017. YINCAE is scheduled to exhibit at booth # 416.

Dr. Wusheng Yin, the president of YINCAE Advanced Materials, is scheduled to speak at the technical conference. Dr. Yin will be presenting his white paper, “High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives.” The presentation will be on held on Tuesday, October 10 at 2:30pm in Room 305A.

YINCAE Advanced Materials, LLC  hopes you will come join us at the conference to learn about YINCAE and the products we have to offer. YINCAE is continuously developing new products to meet industrial needs. Please visit YINCAE at Booth # 416.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

* * * * * * * * * *

 Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

 ###

Sep 25, 2017 -

IMAPS 2017-Raleigh 2 weeks away, visit YINCAE Booth 416

Sep 12, 2017 -

SMTA International - Join Dr. Yin’s Presentation September 20th

Sep 11, 2017 -

YINCAE to Exhibit at iMAPS INTERNATIONAL 2017

Aug 15, 2017 -

SMTA International 2017 – 1 month away

Aug 15, 2017 -

SMTA INTERNATIONAL is 1 MONTH AWAY! VISIT YINCAE BOOTH #329 September 19 & 20

Aug 15, 2017 -

High Reliability & High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesive

Aug 08, 2017 -

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Aug 08, 2017 -

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Jul 25, 2017 -

YINCAE TO EXHIBIT AT SMTAI 2017

Jun 20, 2017 -

SEMICON West is 1 Month Away, Visit Yincae at Booth 5248

27 more news from YINCAE Advanced Materials, LLC. »

Oct 23, 2017 -

W.J. Murphy Associates Receives Outstanding Achievement Award from Juki

Oct 23, 2017 -

Libra Industries Upgrades to the Latest Technology in Post Reflow AOI

Oct 23, 2017 -

Data I/O Announces SentriX™ Secure Provisioning Support for Maxim’s DeepCover® Secure Authentication ICs

Oct 23, 2017 -

Transition Automation Intros Holder for Permalex Hand Squeegee

Oct 23, 2017 -

Manual Cleaning of Printed Board Assemblies – Step By Step Guide Coming Soon

Oct 23, 2017 -

New Online Webinars from the Desk of Bob Willis

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 19, 2017 -

Juki Automation Systems Awards Quantum Systems ‘Representative of the Year –Best Performance’

Oct 19, 2017 -

Logic PD to Exhibit Medical Market Successes at MD&M Minneapolis 2017

Oct 18, 2017 -

Horizon Sales Earns Juki Sales Awards

See electronics manufacturing industry news »

IMAPS 2017 is Next Week VISIT YINCAE BOOTH # 416 Join Dr. Yin’s Presentation October 10th at 2:30 PM Room 305A news release has been viewed 114 times

  • SMTnet
  • »
  • Industry News
  • »
  • IMAPS 2017 is Next Week VISIT YINCAE BOOTH # 416 Join Dr. Yin’s Presentation October 10th at 2:30 PM Room 305A
pcb components vacuum pick up

HeatShield Gel- thermal PCB shield during reflow