SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Aug 08, 2017

(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.

YINCAE has developed a solder joint encapsulant paste compatible with typical lead-free reflow profiles, but also has the ability to withstand high temperature applications (300°C). This paste also enhances solder joint strength, drop performance, and thermal cycling performance. As a result, using this paste can eliminate traditional underfill or corner bonding materials, as well as red glue, currently used for double sided reflow processes.

We welcome you to attend this speaker presentation and stop by our booth, 329, at SMTAI.

Additional information regarding Dr. Yin’s speaking session is available by contacting YINCAE at info@yincae.com.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

* * * * * * * * * *

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

 ###

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Jul 03, 2018 -

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

Jul 03, 2018 -

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

May 18, 2018 -

YINCAE’S SMT 158A Receives High Praise

May 14, 2018 -

YINCAE’S New Highly Conductive Thermal Underfill: SMT 158D

May 08, 2018 -

SEMICON WEST 2018 is in 1 Month! VISIT YINCAE BOOTH 5269

Apr 09, 2018 -

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Mar 30, 2018 -

SEMICON West is 3 months away! Visit YINCAE at Booth #5269

Feb 14, 2018 -

Press Release: DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

Feb 14, 2018 -

Press Release: DA 90 Low Temperature Die Attach Adhesive Series Materials

Feb 14, 2018 -

Press Release: YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

26 more news from YINCAE Advanced Materials, LLC. »

Jul 15, 2018 -

Great Results from Europe’s First atom Platform Installation at Syselec France.

Jul 12, 2018 -

Epec Partners with Wounded Warrior Project

Jul 12, 2018 -

Lacon Electronic GmbH acquires TRI's AOI Solution for Zero Tolerance

Jul 11, 2018 -

Kurtz Ersa Inc. Expands Its North American High-Tech Demo Center

Jul 11, 2018 -

ADLINK Joins Open Networking Foundation (ONF) as Collaborating Innovator to Boost Transformation of Network Infrastructure

Jul 11, 2018 -

IPC Releases 2018 Quality Benchmark Study for Electronics Assembly

Jul 10, 2018 -

IPC Offers Technical Education Course, Designing Boards with HDI Technology, at PCB Carolina

Jul 10, 2018 -

KYZEN today announced the opening of a new state-of-the-art Applications Lab by Astronics Technologies (Thailand) Co. Ltd.

Jul 10, 2018 -

optical control GmbH & Co. KG, a leader in automated component counting technology using X-ray imaging, has hired Mr. Rudy Tan to build and manage its team and continued growth in Asia.

Jul 10, 2018 -

Circuitronics Adds New SMT Line Dedicated to Quick Turn and Prototyping

See electronics manufacturing industry news »

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste news release has been viewed 28 times

  • SMTnet
  • »
  • Industry News
  • »
  • High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste
used pcb assembly equipment - lel semi

Everything You Need to Know About X-Ray - Webinar