SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Aug 08, 2017

(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.

YINCAE has developed a solder joint encapsulant paste compatible with typical lead-free reflow profiles, but also has the ability to withstand high temperature applications (300°C). This paste also enhances solder joint strength, drop performance, and thermal cycling performance. As a result, using this paste can eliminate traditional underfill or corner bonding materials, as well as red glue, currently used for double sided reflow processes.

We welcome you to attend this speaker presentation and stop by our booth, 329, at SMTAI.

Additional information regarding Dr. Yin’s speaking session is available by contacting YINCAE at info@yincae.com.

If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: YINCAE Website.

* * * * * * * * * *

Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.

 ###

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Jun 22, 2023 -

YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA

Mar 27, 2023 -

YINCAE Launches Breakthrough Thermal Underfill: UF 158A2

Nov 08, 2022 -

YINCAE Advanced Materials Wins Global Technology Award at SMTAI 2022 for Adhesives/Underfills/Encapsulants

Aug 16, 2022 -

YINCAE's Fully Flux Residue Compatible Underfill: UF 158HA

Mar 30, 2022 -

YINCAE's DA158N Die Attach Materials withstanding -273°C

Dec 22, 2021 -

Fully Flux Residue Compatible, Room Temperature Fast Flow, Reworkable Underfill SMT 88UL2

Feb 24, 2021 -

YINCAE's New SMT 158N Series withstanding -273°C

Jan 21, 2021 -

World's First Commercially Available Diamond Filled Underfill: SMT 158D8

Aug 04, 2020 -

YINCAE Advanced Materials, LLC. Proudly Announces ISO 9001:2015 Certification

Sep 05, 2019 -

YINCAE To Exhibit at IMAPS 2019 Boston 52nd International Symposium Just 1 Month Away! Visit YINCAE at Booth #530

48 more news from YINCAE Advanced Materials, LLC. »

Mar 27, 2024 -

Red Glue SMT Solutions: A Cost-Effective Approach for Double-Sided PCBs

Mar 26, 2024 -

North American PCB Industry Sales Down 11.6 Percent in February

Mar 26, 2024 -

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Mar 26, 2024 -

Don Dennison Appointed to Roll Out KIC's Latest Thermal Analysis System Software in the Northeast

Mar 26, 2024 -

Altus Group Achieves Record Sales Milestone with Koh Young Europe

Mar 26, 2024 -

STI Welcomes Edrick Young as the Newest Mechanical Assembly Technician

Mar 26, 2024 -

Anda Technologies Receives 2024 NPI Award for Setting a New Standard in Smart Manufacturing

Mar 26, 2024 -

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Mar 26, 2024 -

North American EMS Industry Up 4.1 Percent in February

Mar 26, 2024 -

SMTA Europe Announces 2024 Spring Conferences

See electronics manufacturing industry news »

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste news release has been viewed 902 times

  • SMTnet
  • »
  • Industry News
  • »
  • High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste
Void Free Reflow Soldering

Software for SMT