SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Nov 14, 2016

Engineered Materials Systems, a leading global supplier of conductive interconnect materials for photovoltaic applications, is pleased to introduce its new EMS 561-567 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-567 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.

The adhesive is stress-absorbing, designed to withstand the rigors of thermal cycling, and features excellent conductive stability to cell and ribbon metallization during damp heat exposure. Additionally, the conductive adhesive is designed to cure in seconds at 150°C to 180°C to enable fast fixturing of the cells in the stringer. EMS 561-567 offers a more than 50 percent cost savings compared to standard silver-filled conductive adhesives.

The 561-567 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for photovoltaic applications. For more information about the EMS 561-567 Low-Cost Snap Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com .

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 10, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

May 01, 2017 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

Apr 22, 2017 -

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Mar 22, 2017 -

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

Mar 20, 2017 -

Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers

Mar 14, 2017 -

Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Jan 09, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 04, 2016 -

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Sep 13, 2016 -

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

47 more news from Engineered Materials Systems, Inc. »

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

Aug 16, 2017 -

COT Increases Manufacturing Capability with New DMG Horizontal Milling Centers

Aug 16, 2017 -

High-Performance 3D AOI from Viscom at SMTAI

See electronics manufacturing industry news »

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules news release has been viewed 330 times

  • SMTnet
  • »
  • Industry News
  • »
  • New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules
soldering station

Small Parts Tips