SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Engineered Materials Systems, Inc.


New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Aug 08, 2016

Engineered Materials Systems, a leading global supplier of conductive interconnect materials for photovoltaic applications, is pleased to introduce its new EMS 561-676 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-676 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.

The adhesive is stress-absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to cell and ribbon metallization during damp heat exposure. Additionally, the conductive adhesive is designed to cure in seconds at 150°C to 180°C to enable fast fixturing of the cells in the stringer. EMS 561-676 offers a more than 50 percent cost savings compared to standard silver-filled conductive adhesives.

The 561-676 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for photovoltaic applications. For more information about the EMS 561-676 Low-Cost Snap Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product

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