Engineered Materials Systems, Inc. (EMS), a leading global supplier of negative photoresists for MEMS applications, will showcase its DF-3000 Series Negative Film Photoresists during SEMI MEMS 2015, scheduled to take place September 17-18, 2015 at the AtaHotel in Milan, Italy.
The DF-3000 series is available in various thickness formats from 5 to 50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3000 series films are tougher (less brittle) than most negative photo resists on the market with a glass transition temperature of 158°C (By DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. It is hydrophobic in nature providing for chemical and moisture resistance. DF-3000 series films are compatible with and can be used in contact with the EMS line of spin coatable photoresists.
Company representatives will be available at the show to discuss the company’s full line of negative photoresists as well as conductive and non-conductive adhesives for semiconductor and circuit assembly applications.
DF-3000 series films are the latest addition to EMS’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits. For more information about the DF-3000 series films or to learn how EMS/Nagase can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.