SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems Introduces Room Temperature Cure Conductive Adhesive for General Assembly Applications

Engineered Materials Systems Introduces Room Temperature Cure Conductive Adhesive for General Assembly Applications

Jun 01, 2015

EMS 618-15 Adhesive.

EMS 618-15 Adhesive.

Engineered Materials Systems, a leading global supplier of conductive interconnect materials for circuit assembly applications, announces the introduction of its new EMS 618-15 Adhesive. The room temperature cure two-part conductive adhesive has been designed for circuit assembly applications.

EMS 618-15 is designed to cure in 24-hours at room temperature or rapidly at elevated temperatures. The material has a ten-to-one mix ratio and is available in a two syringe packaging system designed for use with static mix heads. EMS 618-15 forms high strength, high reliability conductive interconnects.

The EMS 618-15 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for circuit assembly applications.

For more information about the EMS 618-15 Room Temperature Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

Dec 04, 2019 -

Engineered Material Systems Introduces Linear Resistance Carbon Inks

Jun 15, 2019 -

Engineered Material Systems Introduces Durable Printed Electronics with SMT

May 13, 2019 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Apr 15, 2019 -

Engineered Material Systems to Showcase Electrically Conductive Adhesives at Intersolar Europe

Feb 21, 2019 -

EMS Introduces Spin on Liquid Negative Photoresist NR-5000

Jan 15, 2019 -

Engineered Material Systems Introduces New High thermal Conductivity Die and Component Attach Adhesive

Sep 27, 2018 -

EMS introduces 5 μm thick dry film negative photoresist DF-3505 for metallization processes

Sep 13, 2018 -

Engineered Material Systems to Showcase Next-Generation Electrically Conductive Adhesives at EU PVSEC

Sep 05, 2018 -

Engineered Material Systems Introduces New Low-Temperature Cure, Low-Cost, Electrically Conductive Adhesive

Jun 11, 2018 -

Engineered Material Systems to Showcase Next Generation Electrically Conductive Adhesives at Intersolar Europe

67 more news from Engineered Materials Systems, Inc. »

Apr 23, 2024 -

New Energy Automotive: I.C.T.'s Conformal Coating Line Expertise in Mexico

Apr 22, 2024 -

ZESTRON Welcomes Whitlock Associates as new Addition to their Existing Rep Team in Florida

Apr 22, 2024 -

IPC Bestows Posthumous Hall of Fame Award to Industry Icon Michael Ford

Apr 22, 2024 -

Two Long-time IPC Volunteers Receive Dieter Bergman IPC Fellowship Award

Apr 22, 2024 -

Camera Microscopes: A Game Changer for Electronics Manufacturing

Apr 22, 2024 -

SMTXTRA Appoints MaRC Technologies as Representative for the Pacific Northwest

Apr 22, 2024 -

ZESTRON Welcomes Angela Marquez as Head of Business Unit, Latin America

Apr 22, 2024 -

Apollo Seiko's J CAT LYRA + ARC 5000 Goes Beyond Traditional Soldering at SMTA Wisconsin

Apr 22, 2024 -

SMTXTRA Partners with Kurt Whitlock Associates to Expand Presence in Florida

Apr 22, 2024 -

IMAPS & IPC to Host Onshoring Workshop April 29 – May 1, 2024, in Arlington, Virginia

See electronics manufacturing industry news »

Engineered Materials Systems Introduces Room Temperature Cure Conductive Adhesive for General Assembly Applications news release has been viewed 926 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems Introduces Room Temperature Cure Conductive Adhesive for General Assembly Applications
ICT Total SMT line Provider

See Your 2024 IPC Certification Training Schedule for Eptac