Oct 27, 2010 
Palomar’s fully automated 3800 Ultra Flexible Die Bonder is the first of its kind to combine throughput, precision, accuracy and flexibility, accommodating many application types on one platform. Palomar engineers created an entirely new control architecture for micron-level precision motion control and process sequencing (as evidenced in the data). Expanding on the proven technology of Palomar’s three-generation 3500 Die Bonder and more recent 6500 1.5 micron accuracy Die Bonder, the 3800 is a sophisticated “all in one” solution.
Also new to the 3800 is a stiff mechanical structure and cantilever design permitting open access on three sides for ease of loading and unloading, along with the option to integrate an in-line assembly system. The 3800 features a user-friendly ergonomic user interface, 0.1 micron linear encoders and a built-in process camera for live view of pick tool during pick-and-place, combined with fast, quiet linear motors, making it the most versatile die bonder on the market today.
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
Palomar Technologies was originally established in the 1970’s within the Assembly and Test Products line of Hughes Aircraft Industrial Products Division (IPD). Palomar's award-winning
