Jan 08, 2016 
NPL Electronics Interconnection Group Webinars 2016 Launched
We are very pleased to help organise the NPL monthly webinars which are free to join and provide support to the industry world wide
Testing Solder Mask for Assembly Process Compatibility
Bob Willis
Monday 18th January starting at 2.30pm UK Time
Solder mask or solder resist as it is often called, is often overlooked when specifying and procuring bare printed circuit boards. Most commonly it is specified as green, photo imagible and meets the requirements of IPC 840 but there is more to it than that. This webinar will highlight some of the most common assembly problems associated with solder mask and highlight key issues to be aware of during design and manufacture. The session will also highlight some of the tests conducted on solder mask in previous NPL projects along with the IPC standard requirements
Book your place Click Here https://attendee.gotowebinar.com/register/5473791466647566082
Topics Covered:
Why are solder masks used?
Solder mask materials
Solder mask problems in production
Test methods for solder masks
The webinar will run for between 45-60min with question and answer session. The webinars are limited to 100 delegates/companies
High Temperature Electronic Joining – How does HMP solder perform compared to new alternatives?
Martin Wickham
Thursday 17th March starting at 2.30pm UK Time
This webinar will summarise work undertake at NPL to better understand electrical interconnection materials which can offer an alternative to High Pb-based solders. The projects discussed will include those involving harsh environment applications. Subject areas covered will include use of sintered silvers and high temperature conductive adhesives for operation above 200oC for such applications as aerospace, oil and gas, and automotive.
During the webinar recent work conducted as part of the ELCOSINT project will be reviewed which focussed on high temperature electronics aiming to have a significant impact on energy efficiency and the environment. Over the last 3 years the project partners Microsemi, Gwent Electronic Materials (GEM) and National Physical Laboratory (NPL) have successfully developed materials specifically designed to offer an alternative for high Pb content materials to further increase the operating temperature of electronic assemblies. These materials will be suitable for operating at temperatures above 250oC utilising standard manufacturing processes which, until now, have been a road block for high temperature interconnects in, for example, SiC applications.
Book your place Click Here https://attendee.gotowebinar.com/register/1884717232754004737
Topics Covered:
Requirements of high temperature application
Alternative materials
Reliability issues with existing materials
Results and future work on high temperature alternatives
The webinar will run for between 45-60min with question and answer session. The webinars are limited to 100 delegates/companies
Impact of Surface Mount Rework on Reliability
Martin Wickham & Bob Willis
Wednesday 11 May starting at 2.30pm UK Time
Does rework impact the reliability of modern printed board assemblies? What is the weak link in the chain and how could reliability be assessed? There is a limited amount of data on the impact of rework on printed board assemblies, even though some industry sectors say they do not allow rework. The webinar will look at some of the results of testing on solder joints and the impact re-terminating components and the possible problems associated with mixing lead-free solder alloys.
Book your place Click Here https://attendee.gotowebinar.com/register/1168111628862733057
Topics Covered:
Rework procedures
Rework failures on solder joints, components and PCBs
Reliability test results
Difficulty in the assessment of reliably rework
The webinar will run for between 45-60min with question and answer session. The webinars are limited to 100 delegates/companies
How Good Are Conformal Coatings at Preventing Sn Whisker Failures?
Martin Wickham
Wednesday 20 July starting at 2.30pm UK Time
For the last two years, NPL and industrial partners have been investigating conformal coating of assemblies as a mitigation strategy for tin whiskers by using a specially designed test vehicle incorporating SM components. This webinar will provide details of the project including the test methodology employed with an update on results to date. Now the validity of the test vehicle has been proven, further work is planned and this is also be discussed.
Book your place Click Here https://attendee.gotowebinar.com/register/8077519663621158145
Topics Covered:
Conformal coating types
Coating coverage
Methods of testing coatings
Formation of tin whiskers
How do coatings reduce failure?
The webinar will run for between 45-60min with question and answer session. The webinars are limited to 100 delegates/companies
Development of Condensation Testing & Industry Benefits
Chris Hunt
Wednesday 14 September starting at 2.30pm UK Time
NPL have developed a new test method to control the rate of condensation on to printed board assemblies during environmental testing. The method provided considerable improvements on existing industry standard tests and the EI Group are currently running a multi partner project to refine the test and fine criteria.
This webinar will provide an overview of the test methods and some results from other NPL SIR assessment projects in Europe
Book your place Click Here https://attendee.gotowebinar.com/register/796849433116420865
Topics Covered:
Review of existing test methods
Disadvantages of industry procedures
NPL condensation test benefits
Results of selected production trials
The webinar will run for between 45-60min with question and answer session. The webinars are limited to 100 delegates/companies
Solder Joint & Cleanliness Reliability Assessment in Production (Sweden Project)
Chris Hunt, Ling Zou & Bob Willis
Wednesday 9 November starting at 2.30pm UK Time
This webinar will look at results of different production trials conducted on test boards produced on two production lines as part of a NPL supported project in Sweden. The tests conducted will look at a number of different soldering process and materials and the impact on solderability, solder joint formation, cleanliness and surface resistance. A special test board features QFN packages with SIR test coupons and other fine pitch and area array packages is being processed through no clean and cleaning processes
Book your place Click Here https://attendee.gotowebinar.com/register/7831351104790223617
Topics Covered:
Assembly process for clean and no clean
Test board design
Test board assessment
Cleanliness results
SIR test procedure
