SMT, PCB Electronics Industry News

Prototype and Debug 96 ball BGA with Ease

Feb 14, 2011

PA-BGA96C-Z-01 probing and prototyping adapter is constructed with gold plated solder-tail machined pins for maximum reliability.

PA-BGA96C-Z-01 probing and prototyping adapter is constructed with gold plated solder-tail machined pins for maximum reliability.

BURNSVILLE, MN - Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics.

Socket your 96 BGA PLL Clock Driver using Elastomer Socket with Superior Electrical Performance and Adapt to Standard Prototyping System

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -35 C to +100 C. The pin self inductance is 0.11 nH and mutual inductance of 0.028 nH. Capacitance to ground is 0.028 pF. Current capacity is 2 amps per pin. Works with most of 0.8mm pitch, 16x6 array Clock driver IC's.

The BGA socket is mounted on a PCB which interfaces the 96 position BGA socket to a 0.100" center pin grid array (PGA) on the bottom side. PA-BGA96C-Z-01 is constructed with gold plated solder-tail machined pins for maximum reliability. This allows the adapter for plug-in to a receptacle mounted on a prototype system as well as soldering directly. Optionally the adapters can be supplied with wire-wrap pins so the prototype can be built on a very inexpensive wire-wrap panels.

The BGA socket is also routed to 0.100" center test points on the top side of PCB for quick signal access during debug process. The specific configuration of the package to be tested in the PA-BGA96C-Z-01 is a BGA, 13.5x5.5mm, 0.8mm pitch, 96 position, 16x6 ball array. To use, place the BGA device into the socket base, lock the swivel socket lid assembly and turn the compression screw to apply pressure.

Pricing for the PA-BGA96C-Z-01 is $760 at qty 1 with reduced pricing available depending on quantity required.

Apr 06, 2011 -

8 GHz Bandwidth Socket for Intel's ICH6 (I/O Controller Hub 6) BGA Package

Mar 22, 2011 -

Stamped Spring Pin BGA Socket for IDT's FCBGA144

Mar 11, 2011 -

Elastomer Socket for Infineon's BGA221

Feb 26, 2011 -

GHz Bandwidth Socket for Dual WLCSP

Feb 03, 2011 -

Stamped Spring Pin BGA Socket for Burn-in Characterization

Jan 12, 2011 -

ATE Spring Pin BGA Socket for Digital Camera Processor

Dec 10, 2010 -

Spring Pin Socket for Kelvin Resistance Measurement

Nov 30, 2010 -

Package Converters Enable Testing Generation I product on Generation II System

Mar 27, 2024 -

Red Glue SMT Solutions: A Cost-Effective Approach for Double-Sided PCBs

Mar 26, 2024 -

North American PCB Industry Sales Down 11.6 Percent in February

Mar 26, 2024 -

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Mar 26, 2024 -

Don Dennison Appointed to Roll Out KIC's Latest Thermal Analysis System Software in the Northeast

Mar 26, 2024 -

Altus Group Achieves Record Sales Milestone with Koh Young Europe

Mar 26, 2024 -

STI Welcomes Edrick Young as the Newest Mechanical Assembly Technician

Mar 26, 2024 -

Anda Technologies Receives 2024 NPI Award for Setting a New Standard in Smart Manufacturing

Mar 26, 2024 -

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Mar 26, 2024 -

North American EMS Industry Up 4.1 Percent in February

Mar 26, 2024 -

SMTA Europe Announces 2024 Spring Conferences

See electronics manufacturing industry news »

Prototype and Debug 96 ball BGA with Ease news release has been viewed 1343 times

Cost-effective Conformal Coating Machine

IPC Training & Certification - Blackfox