Mar 17, 2015 
CyberOptics® Corporation (NASDAQ: CYBE) today announced that it will exhibit its latest lineup of 3D SPI and AOI systems in Stand B-1D10 at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center.
The SQ3000™ 3D Automated Optical Inspection (AOI) system maximizes ROI and line utilization with multi-view 3D sensors that capture and transmit data simultaneously, and in parallel, enabling the fastest 3D inspection in the industry. The MRS technology inside combined with the highly sophisticated 3D fusing algorithms offers microscopic image quality at production speeds. An easy-to-use, intuitive interface with touch control facilitates minimal training and operator interaction.
The SE600™ 3D SPI system delivers ‘true’ volume measurement and world-class usability. Designed with a state-of-the-art dual illumination sensor, it offers the best repeatability and reproducibility – even on the smallest paste deposits. The award-winning SPIv5 series software offers full touch screen capability and world-class user experience for easy, flawless inspection.
The CX150i™ system offers simple, fast and reliable automated conformal coating inspection using a brand-new UV Strobed Inspection Module (SIM). Designed with an 80 Megapixel sensor, CX150i™ offers white light illumination for component presence/absence inspection and UV illumination for conformal coating inspection. Powered by AI2 (Autonomous Image Interpretation) technology, CX150i™ enables faster, simpler and smarter programming.
All CyberOptics’ AOI systems are powered by AI2 (Autonomous Image Interpretation), giving you the power to inspect ‘ANYTHING’ without having to anticipate defects or predefine variance. AI2 offers precise discrimination even with excessive variance and delivers accurate results with just one example. All of this means lowest false calls, zero escapes and minimal tuning.
Founded in 1984, CyberOptics Corporation is a leading provider of sensors and inspection systems that provide process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. The Company’s products are deployed on production lines that manufacture surface mount technology circuit boards and semiconductor process equipment. Through internal development and acquisitions, CyberOptics is strategically repositioning itself to become a global leader in high-precision 3D sensors.
Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through facilities in North America, Asia and Europe.
Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; expectations regarding LDI and its impact on our operations; integration risks associated with LDI; forecasts for at least 10% growth in sales and break-even operating results for 2015 and other factors set forth in the Company’s filings with the Securities and Exchange Commission.
