SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Endicott Interconnect Technologies' Wire Bond Product Launched into Space.

Endicott Interconnect Technologies' Wire Bond Product Launched into Space.

Nov 08, 2007

Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.

The ground breaking Orbital Express, consisting of two satellites (ASTRO & NextSat), is funded by the Defense Advanced Research Projects Agency (DARPA) and was launched on March 8, 2007 from Kennedy Space Center. Northrop Grumman is the team member responsible for the design, development, production and operational support for the fluid transfer systems and the propulsion system on the Orbital Express satellites. These unmanned spacecraft have successfully demonstrated docking, inspecting, and servicing of satellites. The Northrop Grumman Space Technology Servicing Interface Electronics assemblies, each containing several EI PBGA modules, comprise the complete set of processing, routing and control hardware and software that performed as the primary electronic interface (communication, control, and telemetry) for the fluid transfer system with the ASTRO and NextSat vehicles.

EI assisted Northrop Grumman�s Space Technology sector based in Redondo Beach, CA, with the transition from ceramic to wire bond PBGA substrates, which provide superior performance in thin profile, light weight packages.

�The task of the electronic package is to connect individual die or multiple semiconductors to printed circuit boards,� explains Kim Blackwell, Microelectronics Packaging Product Manager at EI. �This ASIC provides microcontroller functions and specified the assembly of a large quantity of electronic packages to the printed circuit board, which results in a very heavy board when traditional ceramic materials are used. Transitioning to EI�s wire bond PBGA organic materials, packed more computing power into a smaller space and significantly reduced overall assembled board weight, translating directly into launch benefits.�

About Northrop Grumman

Northrop Grumman Corporation is a $30 billion global defense and technology company whose 120,000 employees provide innovative systems, products and solutions in information and services, electronics, aerospace and shipbuilding to government and commercial customers worldwide.

http://www.st.northropgrumman.com

Dec 03, 2010 -

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Jul 08, 2008 -

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award

Jun 19, 2008 -

Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.

May 12, 2008 -

Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction

May 12, 2008 -

Cutting-edge Microelectronics Manufacturing Research Center Opens at Endicott Interconnect Technologies, Inc.

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Strengthens Management Team with New CFO Appointment

Jan 16, 2008 -

Pinto Joins Endicott Interconnect Technologies, Inc. as VP of Human Resources

15 more news from i3 Electronics »

Apr 19, 2024 -

ViTrox Pioneering the Future of Smart Manufacturing at NEPCON China 2024! Booth #1H27

Apr 18, 2024 -

ViTrox Technologies Elevates Service & Support Across US & Canada with Jeremy Woodworth's Appointment!

Apr 16, 2024 -

I.C.T | Your One-Stop Service for Smart Meter SMT Factory

Apr 15, 2024 -

Three Industry Leaders Receive IPC President's Award

Apr 15, 2024 -

IFTEC's Pierre-Jean Albrieux Inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024

Apr 15, 2024 -

IPC Honors Summit Interconnect and Robert Bosch GmbH with Corporate Recognition Awards

Apr 15, 2024 -

IPC Publishes Comprehensive Strategy to Address Electronics Industry's Global Workforce Challenge, Calls on Leaders in Government, Business and Education for Support

Apr 15, 2024 -

Data I/O Announces Major Milestone with 500th PSV System Sale Ahead of IPC APEX Expo

Apr 15, 2024 -

IPC Announces New Board Members at IPC APEX EXPO 2024

Apr 15, 2024 -

Seika Machinery Recognizes Outstanding Sales Achievements at 2024 IPC APEX EXPO

See electronics manufacturing industry news »

Endicott Interconnect Technologies' Wire Bond Product Launched into Space. news release has been viewed 996 times

  • SMTnet
  • »
  • Industry News
  • »
  • Endicott Interconnect Technologies' Wire Bond Product Launched into Space.
convection smt reflow ovens

Reflow Oven