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PF606-P245 Lead-free Solder Paste Offers Continuous High-Speed Printability

Jul 02, 2018

SHENMAO America, Inc. is pleased to introduce the PF606-P245 New Generation Lead-free Zero Halogen Solder Paste. The paste provides continuous high-speed printability that produces superior solder paste print quality as well as a wide reflow process window for excellent solderability.

With a minimal flux residue gathering near the outside of the solder joint on the PCB substrate, SHENMAO’s PF606-P245 offers a significant improvement over predecessors. Additional benefits include:

• Prevents Head-on-Pillow issues

• Produces the lowest void

• Easily fits complicated PCB designs through convergence performance

• Improves ICT testability with flux completely removed from top of solder to prevent contamination of test pins during test operation

• Minimal flux residue gathers near outside of solder joint on the PCB substrate, a substantial improvement over legacy solder paste

SHENMAO is dedicated to producing solder products including water soluble and no-clean solder paste, laser solder paste, solder preform, cored solder wire, wave solder bar alloys, wave soldering fluxes, extremely pure solder powder up to Type 8, BGA and micro BGA solder sphere, wafer-level packaging solder paste and fluxes, led die attach paste, high-performance liquid fluxes, solder preform, solar ribbon, and plating anode used in PCB fabrication, assembly and semiconductor packaging processes.

SHENMAO has been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.


SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes. For more information, please visit www.shenmao.com.

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May 20, 2018 -

SHENMAO America to Participate in the eSMART Factory Conference

May 16, 2018 -

SHENMAO America to Show New Solder Alloy with High Thermal & Impact Reliability at SMTA Michigan Expo

Apr 25, 2018 -

SHENMAO Technology to Exhibit New Solder Alloy with High Thermal & Impact Reliability at SEMICON Southeast Asia

Apr 05, 2018 -

SHENMAO Technology will attend AutoTronics Taipei 2018

Jan 24, 2018 -

SHENMAO America to Solve Solder Paste Problems at APEX

Nov 28, 2017 -

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability, Sponsors MEPTEC SEMICONDUCTOR PACKAGING SYMPOSIUM November 30, 2017, E

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