Seika Machinery, Inc. Introduces SAWA Ultrasonic Stencil Cleaner

TORRANCE, CA � November 2008 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the SC-5000 tabletop ultrasonic stencil and misprint cleaner, which is part of its SAWA platform of products. The system comes complete with cleaning head, generator, foot pedal, large 32 x 32 tray and 30 foam pads.

The SAWA 5000GUS removes solder balls from stencil apertures after normal wipe cleaning. A powerful handheld ultrasonic cleaning head (W4.61xD4.61xH3.94") is manually applied over apertures with any solvent of choice. During application of the cleaning head, the stencil is laid on a foam pad soaked with solvent contained within a large tray. The foam is used to capture solder balls dislodged by the cleaning head. A similar method is utilized for cleaning misprinted bare boards.

More than 3,000 SAWA cleaners have been sold to major CMs and OEMs globally. Sawa cleaners have been qualified in facilities in the U.S. such as Motorola and Delphi. Sawa ultrasonic systems are environmentally friendly, fast, safe and effective for fine-pitch stencil cleaning at an economical price.

Seika Machinery provides technical support and after sales services from its facilities in California and Atlanta. Visit the Web site at http://www.seikausa.com/products/sawa/ for evaluations conducted and details on the SAWA Cleaners.

For more information on the SC-5000 tabletop ultrasonic stencil and misprint cleaner, visit http://www.seikausa.com.

About Seika Machinery, Inc.

Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.