Jan 19, 2009 
The new SP150 fulfils the long-term demands of many small and medium size enterprises: A semiautomatic system, it features integrated stencil cleaning, controlled printing process and digital vision system. This affordable machine can reproducibly print the finest structures even in larger series. Because of the space saving front drawer, the SP150 fits into every production.
The vision system of the SP150 is easy-to-use and cost-effective: two digital cameras look through a stencil aperture onto the substrate. The printer automatically recognizes if the substrate is misaligned. Integrated position encoders in the software can instruct the operator exactly how to correct the alignment. The SP150 continuously controls the result. The print cycle is released only if the alignment is perfect.
The printer also controls all other parameters such as squeegee pressure, printing speed, print stroke and the parallel separation of the stencil from the substrate. The pneumatic printing head holds two squeegees that automatically spread the print pressure over the squeegee length. This ensures even results all over. Both rubber and metal squeegees can be used.
A clean stencil is a prerequisite for reproducible printing results. Therefore, a stencil underside cleaning system is integrated into the SP150. The cleaning device is mounted directly on the front drawer. Each time the drawer is pulled out for PCB loading, the stencil is automatically cleaned.
The Windows-based software supports the operator with an easy-to-use graphical interface. The software controls the printing process and the vision system makes the results independent of the operator and allows reproducible manufacturing of even large series.
The SP150 also is well suited for small series. At product changeover, the correct settings can be found very quickly and the magnetic PCB holder can be aligned without any tools.
For PCB loading, a front drawer is installed, which is ergonomic and saves production floor space. This makes the SP150 a good fit for small and medium size enterprises with limited space. With the short set-up and changeover time and the semiautomatic print process, this printer can be used for production of all batch sizes from small to large.
The PANTERA�XV SMD placement machine directly addresses prototyping and production runs in mid-sized quantities. The PANTERA-XV provides high placement accuracy and speed, a broad application range, high reliability and very low maintenance costs, as well as very short changeover times and excellent cost-performance ratio.
The PANTERA�XV placement machine handles the entire SMD range from 0201s to 50 x 50 mm QFPs with a fine pitch of 0.4 mm. Designed for the assembly of complex printed boards and fast changeover, the machine offers a large number of feeder slots (up to 108) in a small footprint of less than 1 square meter. All intelligent tape and stick feeders will be recognized automatically, regardless of the feeder slot being used. This provides a fast and error-free changeover process. The tape feeders are motorized and the transport speed is programmable. Also, 0201 chips can be reliably placed at a placement speed rated up to 4500 cph.
A further highlight of the system is increased precision, provided by the application of more accurate measuring systems. The resolution of the magnetic linear measuring system is 1 micron; the mechanism is not prone to dirt particles and dust and, therefore, provides high reliability and accuracy. For alignment, an integrated laser system measures small ICs and chip components "on the fly," and a bottom-up vision system is used for fine-pitch ICs or BGAs. Additionally, another vision system is installed for the automated correction of PCB positions as well as for the teach-in of component locations.
The PANTERA�XV placement machine can be customized to match the assembly task by a multitude of options. Just one example of many is the optional dispensing system for solder paste and adhesive that reduces the cost for stencils in prototyping and also allows for higher flexibility. A further example of the optional flexibility is the exchange of the universal standard magnetic PCB holder system.
The graphic-based software concept supports an extremely easy machine operation so that usage and programming can be quickly learned. Also, programming is a painless task: CAD data of layout software can be directly converted in an appropriate assembly program. In the case that such a data set is not available, the components can be placed manually (i.e. virtually) by means of an integrated camera.
The PANTERA�XV SMD placement machine is designed for the flexible assembly of small and mid-sized production volumes. With its solid construction and high reliability, the equipment can be used efficiently for larger production quantities.
Soldering of complex SMD PCBs and new housing technologies require an exact controlled soldering process. The RO300FC-C is a full convection oven that allows fast and homogenous heating, as well as high-temperature soldering of sensitive electronics. The integrated convection technology offers a unique and innovative and efficient way of heating with a vertical hot air stream that evenly heats the complete PCB. Both standard and lead-free pastes can be used.
As an innovative new feature, RO300FC-C now features RO-CONTROL software for increased process simulation and control. RO-CONTROL combines all the important functions for the process evaluation and process control for reflow ovens. This technologically advanced software offers many of the same features as thermal profilers, but for less than half the price. Also, because the software is within the RO300FC, Essemtec is able to offer users an industry first.
The high air volume of the RO300FC-C guarantees equal heating rates in all the components and the substrate, which leads to a minimum Delta-T and guarantees a perfect soldering process at every location on the PCB. This 80" long oven offers many of the same options including chain conveyor for double-sided boards, computer control and an N2 option as those available on ovens that are three to four times more expensive.
The temperature of the pre-heat and the peak zones along with the conveyor speed are programmable to obtain the required soldering profile. Measuring the zone temperatures directly in the convection airflow guarantees reproducible results with lowest Delta-T values (2�C). Different profiles for solder and glue are already integrated in the microprocessor control.
The RO300FC-C provides a significant amount of capability at a small footprint and price. The oven can be used for prototypes, small batches and production runs up to 700 boards in an eight-hour shift. The oven can produce prototypes or production with lead-free products with minimum space and low power requirements, providing major cost benefits to users.
RO-CONTROL Software enables the simulation of soldering profiles at different settings and the comparison with a solder paste library. The number of profiles managed with RO-CONTROL is unlimited. The software also controls and supervises the reflow oven, ensuring a save operation. A saved parameter set can be selected from the profile library and can be transmitted to the reflow oven. RO-CONTROL steers and supervises the oven, and the actual status is displayed on the screen. Additionally, the paste editor allows the design and save profile references for different solder pastes. These references can be used by the profile simulator for comparison. The software also has the capability to save the process changeover to a lead-free process.
The RO300FC-C with RO-CONTROL Software is built in Switzerland with the highest quality parts. The Essemtec five-year warranty on heaters and blowers is the highest in the industry for small ovens. The oven offers simple and straightforward maintainability/reparability with the ability to completely remove each zone and clean them individually, along with full access to the electrical and electronics through drawers in the front of the oven.
Environmental factors are key and include low power consumption and low noise levels. The RO300FC-C is delivered complete with 20 preset profiles for production tasks and materials. For process specialists, the oven control offers additional memory for customized temperature settings and optional PC control with built-in oven profiling software. Because of this feature, the operator finds it extremely easy to use and can process even difficult lead-free pastes without extensive setup time.
Essemtec also offers attractive solutions for financing of capital investments and service contracts. With this machine, users also have access to Essemtec remote maintenance system and to the MyEssemtec.com user portal on the Internet. Of great importance for the customers' decision and production planning is the save-investment program: in the case that the production requirements might change over time, Essemtec guarantees a fair price for the used machine, based on its age, in return for a faster piece of equipment. The existing assembly programs still can be used and the machine/user software is identical. Additionally, Essemtec offers attractive solutions for financing and service.
About the company:
Essemtec is a worldwide leader in the manufacturer of Surface Mount Technology (SMT) production equipment. Essemtec specializes in high mix production equipment for Printed Circuit Boards (PCB) using Surface Mount Technology.
Essemtec is the only manufacturer to cover the entire production process, from Printers and/or Dispensers, to Pick-and-Place and Soldering equipment. Therefore, customers benefit from unparallel knowledge and the ability to select, from a single source, a complete process solution to meet their requirements.
