Apr 29, 2003
With consumer and telecom markets driving the microelectronics industry to produce smaller and more powerful products, only those solutions that incorporate bare die, flip chip and wafer level packaged ICs will offer the most significant size, performance, time to market and system cost advantages.
The free web conference, entitled �Next Generation Bare Die Packaging,� will explain how advanced packaging approaches can provide leading edge solutions, while still allowing the flexibility to respond to changes in market demand and product differentiation. The presentation will also dispel the myths of known good die (KGD) and identify the tools required to be successful in the world of packaging innovation.
Topics covered in this seminar include:
� PCB design, fabrication and assembly to support die products
� Supply strategies for bare die, flip chip and wafer level CSP
� Roadmapping
� EMS-friendly die products
� Standardization priorities
� Total cost of ownership consideration
� How to integrate bare die into a surface mount line
All participants must obtain a registration form at http://www.ipc.org or http://www.dieproduct.com and return to IPC by e-mail at DiePackagingSummit@ipc.org or by fax at 847-509-9798, no later than May 12, 2003. Once registered, participants will be able to log online, view and listen to the presentation, all from the convenience of their desk or conference room.
For more information, contact Joe Dudeck, IPC�s communications manager, at JoeDudeck@ipc.org or 847-790-5371.
About DPC
The Die Products Consortium is a collaborative effort by a group of microelectronics companies to enlarge the worldwide market for die products. Members of the consortium have been active in promoting the use of die products for over 10 years. Current members include Agilent Technologies, Analog Devices, August Technology, Chip Supply, IBM, Intel, LSI Logic, Motorola, National Semiconductor, Samsung Electronics and Texas Instruments.
About IPC
IPC is a Northbrook, Ill.-based trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of a $40 billion U.S. industry employing more than 350,000 people. IPC maintains offices in Taos, N.M.; Washington, D.C.; Garden Grove, Calif.; and Shanghai, China. For more information, visit http://www.ipc.org.
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