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IPC Honors Best Technical Paper at Annual Meeting

Oct 18, 2001

IPC- Association Connecting Electronics Industries has announced the winner of this year's IPC Annual Meeting Best Technical Paper award.

Mike Kittelson and Jess L. Pedigo, from Honeywell Advanced Circuits, received the Best Technical Paper award for A Review of Filling High Density, High Aspect Ratio Vias in A High Volume Printed Circuit Board Industry. The paper was chosen based on its value and insight into via-filling materials and performance test results for the printed wiring board (PWB) industry.

IPC awarded each winner with a commemorative plaque at a luncheon award ceremony.

For more information on the authors or winning paper, contact John Perry, IPC technical project manager, at 847-790-5318, or e-mail johnperry@ipc.org.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,500 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C..; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Suzhou, Chengdu and Beijing, China.

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