Jul 30, 2002
Mechanical samples of the new Amkor etCSP are now available. This package is the first ball grid array capable of extremely thin 0.5mm maximum mounted height. This thin package can squeeze into applications when a thin form factor is required because vertical height is limited.
Body size is 12x12mm with 176 I/O 0.5mm pitch or 7x7mm with 80 I/O 0.5mm pitch. The resulting package consists of two peripheral rows of 0.3mm diameter solder balls to allow common SMT processing. Another benefit of this package design is superior moisture resistance. Available in lead-free.
