SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Practical Components Adds FC150JY Fine-Pitch Glass Chips for Underfill, Adhesive and Other Research and Qualification Applications

Practical Components Adds FC150JY Fine-Pitch Glass Chips for Underfill, Adhesive and Other Research and Qualification Applications

Jul 10, 2018

Practical Components Inc., the world’s leading supplier of dummy components and test boards, announces that it has added the FC150JY Type B 10x10 mm full area glass chip to its extensive lineup of available chips.

The chips are 700 µm (±70 µm) thick with a bump pitch of 150 µm (0.0059") and can be ordered as copper pillar with a SnAg solder cap.

These innovative glass chips provide the solution to checking the mechanical bonding between chip and PCB with underfill,” said Russell Kido, Sales Manager at Practical Components. “These chips also have proven valuable in evaluating SMT adhesives and applications used in surface-mount assemblies on PCBs when fixing components to the board during wave soldering or double-sided reflow.”

FC150JY Type B chips are available as an uncut 8" wafer containing 208 chips per wafer or ordered diced as required and/or with available substrate kits.


Practical Components is a team of dedicated electronics industry professionals offering value pricing, on-time deliver, and superior service to customers. The Practical Components team is ready to provide project assistance in the areas of technical component knowledge, drawings, component land patterns and PCB practice kits.

Jul 15, 2018 -

Great Results from Europe’s First atom Platform Installation at Syselec France.

Jul 12, 2018 -

Epec Partners with Wounded Warrior Project

Jul 12, 2018 -

Lacon Electronic GmbH acquires TRI's AOI Solution for Zero Tolerance

Jul 11, 2018 -

Kurtz Ersa Inc. Expands Its North American High-Tech Demo Center

Jul 11, 2018 -

ADLINK Joins Open Networking Foundation (ONF) as Collaborating Innovator to Boost Transformation of Network Infrastructure

Jul 11, 2018 -

IPC Releases 2018 Quality Benchmark Study for Electronics Assembly

Jul 10, 2018 -

IPC Offers Technical Education Course, Designing Boards with HDI Technology, at PCB Carolina

Jul 10, 2018 -

KYZEN today announced the opening of a new state-of-the-art Applications Lab by Astronics Technologies (Thailand) Co. Ltd.

Jul 10, 2018 -

optical control GmbH & Co. KG, a leader in automated component counting technology using X-ray imaging, has hired Mr. Rudy Tan to build and manage its team and continued growth in Asia.

Jul 10, 2018 -

Circuitronics Adds New SMT Line Dedicated to Quick Turn and Prototyping

See electronics manufacturing industry news »

Practical Components Adds FC150JY Fine-Pitch Glass Chips for Underfill, Adhesive and Other Research and Qualification Applications news release has been viewed 38 times

  • SMTnet
  • »
  • Industry News
  • »
  • Practical Components Adds FC150JY Fine-Pitch Glass Chips for Underfill, Adhesive and Other Research and Qualification Applications
used pcb assembly equipment - lel semi

Ecolloy Soldering Alloy