Jan 21, 2009 A Novel Flexible Ag (Silver) Paste will explore the features and benefits of silver metallization paste, LTTF-6363, developed for thin film photovoltaic flex solar cells. Next Level Requirements for Ultra Fine Pitch Printing will review the new technology requirements and explore how they will affect the performance of solder paste and stencil technology in the manufacturing and printing processes. Both papers will be presented as part of session THA1: Materials and Deposition on Thursday, February 12th.
Indium Corporation is also sponsoring the event's welcome reception for symposium attendees on Tuesday, February 10th.
Sponsored by the SMTA, the 14th Annual Pan Pacific Microelectronics Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, solar electronics, and assembly.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001.
For more information about Indium Corporation, visit http://www.indium.com/ or email abrown@indium.com
