SMT, PCB Electronics Industry News

Indium Corporation Technology Experts Presenting at IPC Midwest

Aug 24, 2011

Dr. Ning-Cheng Lee, Indium's Vice President of Technology

Dr. Ning-Cheng Lee, Indium's Vice President of Technology

Ronald C. Lasky, Ph.D., PE, Indium's Senior Technologist

Ronald C. Lasky, Ph.D., PE, Indium's Senior Technologist

Indium Corporation experts will present technical findings at IPC Midwest Conference & Exhibition, September 21-22, 2011, in Schaumburg, Illinois.

Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present Thermal Pad Design at QFN Assembly for Voiding Control, which analyzes and presents the effects of variables on voiding.

Indium Corporation’s Senior Technologist, Dr. Ronald C. Lasky , Ph.D., will be presenting Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability. Low silver lead-free alloys have been shown to have superior drop shock performance, but people have questioned whether or not their thermal cycle performance is adequate. This paper will discuss these issues.

Dr. Lasky will also be presenting the tutorial Lead-Free Assembly for High Yields and Reliability, which will provide a framework for discussion of quality, manufacturability and reliability, and for examination of material properties and design parameters. It will also explore options for increasing the reliability of electronics assemblies.

In addition, Dr. Lasky will moderate Minimizing Defects in Assembly Processing.

Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.

Dr. Lasky has more than 30 years experience in electronic and optoelectronic packaging and assembly, including work at IBM, Universal Instruments and Cookson Electronics. He has authored or edited five books on science, electronics, and optoelectronics, as well as several technical papers and articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization. He is the co-creator of engineering certification exams in electronics assembly and is the director of Dartmouth’s Six Sigma Program. Dr. Lasky was awarded the SMTA Founder’s Award in 2003. He also authors a technology blog which can be found at .


Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

Feb 26, 2024 -

Indium Corporation Advisor to Present, Host Tutorial at TestConX 2024

Feb 19, 2024 -

Indium Corporation Expert to Present Technical Paper at IMAPS France

Feb 19, 2024 -

Indium Corporation Prepared to Deliver Three Presentations at APEC 2024

Feb 19, 2024 -

Indium Corporation to Kick Off Season Three of EV InSIDER Live Webcast Series with Charging Session

Jan 29, 2024 -

Indium Corporation Experts to Present at SMTA Pan Pac

Jan 29, 2024 -

Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West

Jan 29, 2024 -

Indium Corporation to Feature High-Reliability Materials for Power Electronics at NEPCON Japan

Jan 29, 2024 -

Indium Corporation Announces Updates to China Leadership Team

Jan 29, 2024 -

Indium Corporation Expert to Present at iNEMI Seminar Hosted by Zestron Europe

Jan 08, 2024 -

Indium Corporation Expert to Present at Power Device & Module Expo at NEPCON Japan

407 more news from Indium Corporation »

Mar 27, 2024 -

Red Glue SMT Solutions: A Cost-Effective Approach for Double-Sided PCBs

Mar 26, 2024 -

North American PCB Industry Sales Down 11.6 Percent in February

Mar 26, 2024 -

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Mar 26, 2024 -

Don Dennison Appointed to Roll Out KIC's Latest Thermal Analysis System Software in the Northeast

Mar 26, 2024 -

Altus Group Achieves Record Sales Milestone with Koh Young Europe

Mar 26, 2024 -

STI Welcomes Edrick Young as the Newest Mechanical Assembly Technician

Mar 26, 2024 -

Anda Technologies Receives 2024 NPI Award for Setting a New Standard in Smart Manufacturing

Mar 26, 2024 -

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Mar 26, 2024 -

North American EMS Industry Up 4.1 Percent in February

Mar 26, 2024 -

SMTA Europe Announces 2024 Spring Conferences

See electronics manufacturing industry news »

Indium Corporation Technology Experts Presenting at IPC Midwest news release has been viewed 860 times

Capillary Underfill Dispensing

fluid dispensers