Kyzen�s presentation will take place on Friday, May 16, 2008 at 8:30 a.m. during the International Conference on Soldering and Reliability. The paper is entitled �Quantifying Cleaning Relevance when Manufacturing Lead-Free Printed Circuit Board Assemblies.�
The International Conference on Soldering and Reliability is sponsored by the SMTA and held in co-operation with the SMTA Toronto Chapter.