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Plasma Etch, Inc. announces the Mark II Plasma System with Gasless Technology

Nov 06, 2017

The Gasless Mark II Plasma System is able to perform Desmear or Etch Back without the use of CF4 gas.

The Gasless Mark II Plasma System is able to perform Desmear or Etch Back without the use of CF4 gas.

For Immediate Release:  November 7, 2017

Plasma Etch, Inc. announces the Mark II Plasma System with Gasless Technology

Carson City, NV – Plasma Etch Inc, a leader in plasma treatment, rolled out the company’s patented gasless etching technology on the Mark II line of plasma etchers over the past year.

The patented gasless technology, originally developed for larger systems, has been condensed and allows the Mark II to offer unmatched speed and uniformity.

Since the release of the gasless technology, sales of the Mark II system have soared.  The gasless Mark II is able to perform desmear and etch back without the added expense and environmental impact of CF4 gas.  The system uses only electricity and oxygen.

This system is very popular with PCB manufacturers.  Not only can you etch and desmear without CF4 gas, but customers have reported the gasless Mark II etching faster and more uniformly than a standard Mark II running CF4.

The company expects this growth to continue through 2018.

Plasma Etch’s full line of plasma products may be viewed on their website: www.plasmaetch.com

About Plasma Etch:  Plasma Etch has been a leading manufacturer and industry innovator since 1980.  The company holds several patents for the invention, development and manufacturing of groundbreaking innovations, paving the way for plasma technology and the enhancement of quality manufacturing worldwide.  Plasma Etch specializes in plasma cleaning solutions of all sizes. Their products are industry proven and set the standard for reliability, speed and uniformity in plasma processing.

Contact information:

Plasma Etch, Inc.

3522 Arrowhead Drive

Carson City, NV 89706

(775) 883-1366

www.plasmaetch.com

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