The SMTA is pleased to announce that Mike Bixenman, DBA, KYZEN Corporation was selected to win the “Best of Presentation” Award at the 2017 International Conference on Soldering and Reliability (ICSR) for his presentation “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach.” The award is determined through the evaluations of those that attended the presentation.
“I am most appreciative of the attendees at International Conference on Soldering and Reliability for selecting my presentation for the Best of Presentation award,” said Mike Bixenman, DBA, KYZEN Corporation, regarding his award. “There were many good presentations and to be recognized by my peers is a true honor.”
The scope of the International Conference on Soldering and Reliability was broadened this year to include the physical design aspects relating to electronics component, product and system reliability, involving such topics as thermal and mechanical design, design for manufacturability, test and signal integrity.
Plans for the 2018 conference are currently under way and more information will be announced at a later date.
All papers presented at the conference can be found in the conference proceedings available online in the SMTA Bookstore at:https://www.smta.org/store/book_detail.cfm?book_id=471
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.