SMT, PCB Electronics Industry News

SMTA SE Asia Technical Conference Program Finalized

Feb 16, 2012

SMTA is very excited to announce the three-day South East Asia Technical Conference on Electronics Assembly Technologies, to be held April 18-20, 2012 at the Eastin Hotel in Penang, Malaysia.

Conference Chair Dr. LyGuat Lee, Flextronics, has assembled a highly technical program that will be very informative for attendees of various backgrounds. Conference sessions will cover Soldering Processes and Materials, Soldering Challenges - Including Head in Pillow, Business and Supply Chain, Harsh Environments, Soldering - Through Hole Processes, Substrates and Printed Circuit Boards, Components and Advanced Packaging.

Companies participating in the program include Agilent Technologies, Celestica, Inc., Cisco Systems Ltd., Henkel, IBM Corporation, Indium Corporation, Kester, and Plexus Corp.

Training workshops will be held on Wednesday, April 18. Workshop topics will be Reliability of Lead-Free Solder Joints, Designing for Reliability, and Electromigration.

Event website: http://smta.org/education/symposia/symposia.cfm#penang

The SE Asia Technical Conference on Electronics Assembly Technology is sponsored by the SMTA with support from the Persatuan Surface Mount Technology P. Pinang.

Contact Patti Hvidhyld, patti@smta.org, with questions or comments.


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Mar 26, 2024 -

SMTA Europe Announces 2024 Spring Conferences

Mar 18, 2024 -

SMTA Announces Workforce Development Breakfast at Ultra High Density Interconnect (UHDI) Symposium

Feb 26, 2024 -

SMTA Capital Chapter Expo and Tech Forum Showcases Innovation in Electronics Manufacturing

Feb 12, 2024 -

SMTA Introduces Ultra High Density Interconnect (UHDI) Symposium

Feb 05, 2024 -

Best Papers from SMTA International Announced

Dec 18, 2023 -

Wafer-Level Packaging Symposium Program Announced

Dec 11, 2023 -

SMTA Women's Leadership Program Announces First Quarter Webinar Schedule for 2024

Nov 27, 2023 -

SMTA Releases Second Batch of Training Resources Donated by Bob Willis

Nov 13, 2023 -

SMTA Hosts Workforce Development Roundtable at Arizona Expo

Nov 06, 2023 -

SMTA Announces Workforce Development Collaborative in Minnesota

734 more news from Surface Mount Technology Association (SMTA) »

Mar 27, 2024 -

Red Glue SMT Solutions: A Cost-Effective Approach for Double-Sided PCBs

Mar 26, 2024 -

North American PCB Industry Sales Down 11.6 Percent in February

Mar 26, 2024 -

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Mar 26, 2024 -

Don Dennison Appointed to Roll Out KIC's Latest Thermal Analysis System Software in the Northeast

Mar 26, 2024 -

Altus Group Achieves Record Sales Milestone with Koh Young Europe

Mar 26, 2024 -

STI Welcomes Edrick Young as the Newest Mechanical Assembly Technician

Mar 26, 2024 -

Anda Technologies Receives 2024 NPI Award for Setting a New Standard in Smart Manufacturing

Mar 26, 2024 -

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Mar 26, 2024 -

North American EMS Industry Up 4.1 Percent in February

Mar 26, 2024 -

SMTA Europe Announces 2024 Spring Conferences

See electronics manufacturing industry news »

SMTA SE Asia Technical Conference Program Finalized news release has been viewed 764 times

Thermal Interface Material Dispensing

Software for SMT