News Releases from Engineered Materials Systems, Inc.
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- News Releases from Engineered Materials Systems, Inc.
78 news releases added by Engineered Materials Systems, Inc.
Company Information:
Engineered Material Systems Introduces Linear Resistance Carbon Inks
Dec 04, 2019 | Engineered Material Systems, Inc. (EMS) is pleased to introduce CI-2069 Series carbon conductive inks for target resistance printing. CI-2069 Series inks feature excellent printability and stable resistance. The new ink series is offered in a suite of electrical resistance ranges.
Engineered Material Systems Introduces Durable Printed Electronics with SMT
Jun 15, 2019 | EMS introduces a revolutionary improvement in durability for printed electronics. EMS inks and adhesives have been designed for compatibility in chemistry and mechanical stress. The unique stack-up design channels paste placement for fillet strength and higher yield with smaller devices.
Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo
May 13, 2019 | Engineered Material Systems announces plans to exhibit at the SNEC PV Power Expo, scheduled to take place June 4-6, 2019 in Shanghai, China. The company will showcase its CA-150 Series snap cure, low cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules in Hall W4, Booth 353.
Engineered Material Systems to Showcase Electrically Conductive Adhesives at Intersolar Europe
Apr 15, 2019 | Engineered Material Systems exhibit in Hall C1, booth 354 at the Intersolar Europa Solar Power Expo, scheduled to take place May 15-17, 2019 in Munich, Germany. Company representatives will show next-generation low-cost electrically conductive adhesives for stringing, shingling and back contact applications in crystalline silicon and heterojunction solar modules.
EMS Introduces Spin on Liquid Negative Photoresist NR-5000
Feb 21, 2019 | Engineered Material Systemsis pleased to announce the availability of its NR-5000 series liquid negative photoresists for microfluidics and wafer level metallization processes. These material formulations have viscosities optimized for wafer coatings from 5 to 50 µm in thickness.
Engineered Material Systems Introduces New High thermal Conductivity Die and Component Attach Adhesive
Jan 15, 2019 | Engineered Material Systems is pleased to debut its TM-6520 low temperature cure adhesive. Designed for die attach and general circuit assembly applications, the adhesive is electrically insulating and offers high thermal conductivity.
EMS introduces 5 μm thick dry film negative photoresist DF-3505 for metallization processes
Sep 27, 2018 | Engineered Material Systems, is pleased to introduce the availability of its DF-3505 series dry-film negative photoresists for wafer level metallization processes. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Engineered Material Systems to Showcase Next-Generation Electrically Conductive Adhesives at EU PVSEC
Sep 13, 2018 | Engineered Material Systems announces plans to exhibit at EU PVSEC, scheduled to take place Sept. 25-28, 2018 in Brussels, Belgium. The company will showcase next-generation low cost conductive adhesives for stringing, shingling and back contact applications in crystalline silicon and heterojunction solar modules in Booth D2.
Engineered Material Systems Introduces New Low-Temperature Cure, Low-Cost, Electrically Conductive Adhesive
Sep 05, 2018 | Engineered Material Systems debuts CA-188-1 low-temperature cure electrically conductive adhesive for die attach and general circuit assembly applications.
Engineered Material Systems to Showcase Next Generation Electrically Conductive Adhesives at Intersolar Europe
Jun 11, 2018 | Engineered Material Systems today announced that it will exhibit at the Intersolar Europa Solar Power Expo, scheduled to take place June 20-22, 2018 in Munich, Germany. The company will showcase its next-generation low cost conductive adhesives for stringing, shingling and back contact applications in crystalline silicon and heterojunction solar modules in Hall A2, booth 315.
Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo
May 08, 2018 | Engineered Material Systems announces plans to exhibit at the SNEC PV Power Expo, scheduled to take place May 28-30, 2018 in Shanghai, China. The company will showcase its CA-150 Series snap cure, low-cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules in Hall W3, Booth 806.
New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications
Mar 12, 2018 | Engineered Material Systems is pleased to debut its DA-6010 Non-Conductive Die Attach Adhesive designed for image sensor attach or chip on board applications.
EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers
Mar 08, 2018 | Engineered Material Systems is pleased to introduce the availability of its DF-3500 series dry-film negative photoresists for wafer level sealing of through-silicon vias. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)
Jan 28, 2018 | Engineered Material Systems is pleased to debut its 506-03A/B, which is a two-component epoxy system with a convenient 1:1 volumetric mix ratio designed to pass rigorous reliability requirements.
Engineered Material Systems to Showcase Jet Dispense SMT at IPC APEX EXPO
Jan 28, 2018 | ngineered Material Systems will exhibit its jet dispensable SMT adhesives at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca.
Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Dec 05, 2017 | Engineered Material Systems announces the availability of 5 µm thick dry-film negative photoresists for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll or vacuum lamination and processing on MEMS and IC wafers.
Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive
Dec 03, 2017 | Engineered Material Systems is pleased to debut its CA-183 low temperature cure electrically conductive adhesive. The low cost, flexible adhesive is designed for die attach and general circuit assembly applications.
New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Oct 22, 2017 | Engineered Material Systems is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules
Oct 18, 2017 | Engineered Material Systems is pleased to debut its 631-68 UV plus thermal cured adhesive for bonding lens holders in camera module applications.
Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS
Sep 13, 2017 | Engineered Material Systems is pleased to announce plans to exhibit at MicroTAS, scheduled to take place Oct. 22-26, 2017 in Savannah, GA. The company will showcase both liquid and dry-film negative photoresists for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation). These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry-film) and processing on MEMS and IC wafers.
Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC
Aug 17, 2017 | Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and heterojunction solar modules. The CA-150 Series will be shown for the first time at the EU PVSEC Photovoltaic Exhibition, scheduled to take place September 25-28, 2017 in Amsterdam, The Netherlands.
New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging
Aug 10, 2017 | Engineered Material Systems is pleased to introduce the DF-3590 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe
May 01, 2017 | Engineered Material Systems announces plans to show its CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules at Intersolar Europe. The new conductive adhesive will be displayed in Hall A2, booth 319 at Intersolar Europe, scheduled to take place May 31-June 2, 2017 in Munich, Germany.
New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging
Apr 22, 2017 | Engineered Material Systems is pleased to introduce the DF-4014 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules
Mar 22, 2017 | Engineered Material Systems is pleased to debut its 631-39 UV plus thermal cured adhesive for bonding lens holders in camera module applications.
Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers
Mar 20, 2017 | Engineered Material Systems is pleased to introduce the DF-35120 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). The dry film is 120 µm thick. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo
Mar 14, 2017 | Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules. The new conductive adhesive will be displayed in Hall W3, booths 806/807 at the SNEC PV Power Expo, scheduled to take place April 19-21, 2017 in Shanghai, China.
New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Jan 09, 2017 | Engineered Material Systems is pleased to introduce the DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules
Nov 14, 2016 | Engineered Materials Systems is pleased to introduce its new EMS 561-567 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-567 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.
Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications
Oct 04, 2016 | Engineered Material Systems is pleased to debut its 640-35 (dam) and 640-46 (fill) dam and fill UV cured chip encapsulants for chip-on-board smart card applications.
Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding
Sep 13, 2016 | Engineered Materials Systems today announced its new EMS 561-338 Fast Cure Conductive Adhesive for die attach applications with small to medium size die. EMS 561-338 is designed to cure in less than one minute at 150ºC.
New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Sep 08, 2016 | Engineered Material Systems is pleased to introduce the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules
Aug 08, 2016 | Engineered Materials Systems is pleased to introduce its new EMS 561-676 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-676 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.
Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference
Dec 05, 2015 | Engineered Materials Systems will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series Negative Film Photoresists.
Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015
Aug 26, 2015 | Engineered Materials Systems will showcase its DF-3000 Series Negative Film Photoresists during SEMI MEMS 2015, scheduled to take place September 17-18, 2015 at the AtaHotel in Milan, Italy.
Engineered Material Systems Introduces DF-3050 Dry Film Negative Photoresist
Aug 23, 2015 | Engineered Material Systems is pleased to introduce the DF-3050 Dry-film Negative Photoresist for use in micro electro mechanical systems (MEMS) and wafer-level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Engineered Materials Systems Introduces Low-Cost Snap Cure Conductive Adhesive for Stringing Solar Modules
Jul 21, 2015 | Engineered Materials Systems introduced its new EMS 561-403 Low-Cost Snap Cure Conductive Adhesive for stringing applications in crystalline silicon and thin-film solar modules. EMS 561-403 is designed to electrically interconnect solar cells using ribbons.
Engineered Material Systems Introduces DF-3005 Dry Film Negative Photoresist
Jun 17, 2015 | Engineered Material Systems is pleased to introduce the DF-3005 Dry Film Negative Photo Resist for use in micro-electromechanical systems (MEMS) and wafer level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Engineered Materials Systems Introduces Room Temperature Cure Conductive Adhesive for General Assembly Applications
Jun 01, 2015 | Engineered Materials Systems announces the introduction of its new EMS 618-15 Adhesive. The room temperature cure two-part conductive adhesive has been designed for circuit assembly applications.
Engineered Materials Systems Introduces Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules
May 18, 2015 | Engineered Materials Systems introduced its new EMS 561-147-2 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-147-2 is designed to electrically interconnect solar cells using ribbons or direct cell to cell contact.
Engineered Material Systems Debuts CA-180 Low-Temperature Cure Conductive Adhesive
May 04, 2015 | Engineered Material Systems introduces its newest conductive adhesive – CA-180. The low-temperature cure conductive adhesive has been designed for die attach and general circuit assembly applications.
Engineered Materials Systems, Inc. to Exhibit DF-3000 Series Negative Film Photoresists at ECTC 2015
Apr 23, 2015 | Engineered Materials Systems will exhibit in Booth #202 at ECTC 2015, scheduled to take place May 26-29, 2015 at the Sheraton Hotel and Marina in San Diego, CA. Company representatives will showcase its DF-3000 Series Negative Film Photoresists.
Engineered Material Systems Introduces New 535-11M-7 UV Cure Adhesive
Apr 20, 2015 | Engineered Material Systems is pleased to debut its 535-11M-7 UV cured epoxy. 535-11M-7 was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications.
Engineered Materials Systems Debuts Low-Cost Conductive Adhesive for Stringing or Shingling Solar Modules
Feb 28, 2015 | Engineered Materials Systems introduces its new DB-1541-S9 Low-Cost Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. DB-1541-S9 is designed to electrically interconnect solar cells using ribbons or direct cell to cell contact.
Engineered Material Systems Introduces a New 535-11M-3 UV Cure Adhesive
Jan 27, 2015 | Engineered Material Systems is pleased to debut its 535-11M-3 UV cured epoxy. 535-11M-3 was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications.
Engineered Material Systems Introduces DF-3020 Dry Film Negative Photoresist
Jan 06, 2015 | Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and IC cooling applications, is pleased to introduce the DF-3020 dry-film negative photo resist for use in micro electro mechanical systems (MEMS) and wafer-level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Engineered Material Systems Sponsors Back Contact Workshop
Oct 30, 2014 | Engineered Material Systems, Inc. (EMS)announces that it is a sponsor for the Back Contact Workshop, scheduled to take place Nov. 13-14, 2014 in Amsterdam, The Netherlands.
Engineered Material Systems to Showcase EMS 561-147 Conductive Adhesive for HIT Modules at the EU PVSEC
Sep 16, 2014 | Engineered Material Systems will introduce its new 561-147 Snap Cure Conductive Adhesive in Hall 1, Booth E19 at EU PVSEC, scheduled to take place Sept. 23-25, 2014 at the RAI Convention & Exhibition Centre in Amsterdam.
Rocket EMS Ramps Up Cleaning Capabilities with Three New Aqua Klean Systems
Sep 09, 2014 | Rocket EMS Inc. today announced that it has installed three new cleaning systems from Aqua Klean Systems. Rocket EMS installed a Typhoon T-8 Chemistry Zero-Discharge Cleaner, T15 Water Soluble Cleaner and DI Recirculating System.
EMS Inc. Installs New Essemtec SMT Line
May 17, 2014 | Essemtec announces that Electronic Manufacturing Solutions, Inc. (EMS, Inc.) recently installed its second SMT line consisting of a Tucano screen printer, Paraquda SMT machine with Jet valve dispenser, conveyors and an upgraded Zonda oven. Additionally, the company is upgrading its original RO400FC reflow oven to a Zonda. This will result in two identical lines for the company, allowing production to be doubled.
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