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News Releases from Engineered Materials Systems, Inc.

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58 news releases added by Engineered Materials Systems, Inc.

Company Information:

Engineered Materials Systems, Inc.

A global manufacturer of adhesives, conductives and encapsulants. For over 20 years, EMS has formulated state of the art acrylics, epoxies, silicones and urethanes.

Delaware, Ohio, USA

OEM

  • Phone 740-362-4444

Engineered Materials Systems, Inc. website

Company Postings:

(58) news releases

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 | Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and heterojunction solar modules. The CA-150 Series will be shown for the first time at the EU PVSEC Photovoltaic Exhibition, scheduled to take place September 25-28, 2017 in Amsterdam, The Netherlands.

Shingling Next-Generation Solar Modules.

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

Aug 10, 2017 | Engineered Material Systems is pleased to introduce the DF-3590 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

DF-3590 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS).

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

May 01, 2017 | Engineered Material Systems announces plans to show its CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules at Intersolar Europe. The new conductive adhesive will be displayed in Hall A2, booth 319 at Intersolar Europe, scheduled to take place May 31-June 2, 2017 in Munich, Germany.

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Apr 22, 2017 | Engineered Material Systems is pleased to introduce the DF-4014 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

Mar 22, 2017 | Engineered Material Systems is pleased to debut its 631-39 UV plus thermal cured adhesive for bonding lens holders in camera module applications.

Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers

Mar 20, 2017 | Engineered Material Systems is pleased to introduce the DF-35120 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). The dry film is 120 µm thick. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Mar 14, 2017 | Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules. The new conductive adhesive will be displayed in Hall W3, booths 806/807 at the SNEC PV Power Expo, scheduled to take place April 19-21, 2017 in Shanghai, China.

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Jan 09, 2017 | Engineered Material Systems is pleased to introduce the DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems.

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Nov 14, 2016 | Engineered Materials Systems is pleased to introduce its new EMS 561-567 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-567 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Oct 04, 2016 | Engineered Material Systems is pleased to debut its 640-35 (dam) and 640-46 (fill) dam and fill UV cured chip encapsulants for chip-on-board smart card applications.

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Sep 13, 2016 | Engineered Materials Systems today announced its new EMS 561-338 Fast Cure Conductive Adhesive for die attach applications with small to medium size die. EMS 561-338 is designed to cure in less than one minute at 150ºC.

Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding.

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Sep 08, 2016 | Engineered Material Systems is pleased to introduce the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

DF-3520 dry-film negative photo.

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Aug 08, 2016 | Engineered Materials Systems is pleased to introduce its new EMS 561-676 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-676 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

Dec 05, 2015 | Engineered Materials Systems will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series Negative Film Photoresists.

Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015

Aug 26, 2015 | Engineered Materials Systems will showcase its DF-3000 Series Negative Film Photoresists during SEMI MEMS 2015, scheduled to take place September 17-18, 2015 at the AtaHotel in Milan, Italy.

DF-3000 Series Negative Film Photoresists.

Engineered Material Systems Introduces DF-3050 Dry Film Negative Photoresist

Aug 23, 2015 | Engineered Material Systems is pleased to introduce the DF-3050 Dry-film Negative Photoresist for use in micro electro mechanical systems (MEMS) and wafer-level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

DF-3050 Dry Film Negative Photoresist.

Engineered Materials Systems Introduces Low-Cost Snap Cure Conductive Adhesive for Stringing Solar Modules

Jul 21, 2015 | Engineered Materials Systems introduced its new EMS 561-403 Low-Cost Snap Cure Conductive Adhesive for stringing applications in crystalline silicon and thin-film solar modules. EMS 561-403 is designed to electrically interconnect solar cells using ribbons.

EMS 561-403 Low-Cost Snap Cure Conductive Adhesive.

Engineered Material Systems Introduces DF-3005 Dry Film Negative Photoresist

Jun 17, 2015 | Engineered Material Systems is pleased to introduce the DF-3005 Dry Film Negative Photo Resist for use in micro-electromechanical systems (MEMS) and wafer level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

DF-3005 Dry Film Negative Photo Resis.

Engineered Materials Systems Introduces Room Temperature Cure Conductive Adhesive for General Assembly Applications

Jun 01, 2015 | Engineered Materials Systems announces the introduction of its new EMS 618-15 Adhesive. The room temperature cure two-part conductive adhesive has been designed for circuit assembly applications.

EMS 618-15 Adhesive.

Engineered Materials Systems Introduces Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

May 18, 2015 | Engineered Materials Systems introduced its new EMS 561-147-2 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-147-2 is designed to electrically interconnect solar cells using ribbons or direct cell to cell contact.

Engineered Material Systems Debuts CA-180 Low-Temperature Cure Conductive Adhesive

May 04, 2015 | Engineered Material Systems introduces its newest conductive adhesive – CA-180. The low-temperature cure conductive adhesive has been designed for die attach and general circuit assembly applications.

CA-180 Low-Temperature Cure Conductive Adhesive.

Engineered Materials Systems, Inc. to Exhibit DF-3000 Series Negative Film Photoresists at ECTC 2015

Apr 23, 2015 | Engineered Materials Systems will exhibit in Booth #202 at ECTC 2015, scheduled to take place May 26-29, 2015 at the Sheraton Hotel and Marina in San Diego, CA. Company representatives will showcase its DF-3000 Series Negative Film Photoresists.

DF-3000 Series Negative Film Photoresists.

Engineered Material Systems Introduces New 535-11M-7 UV Cure Adhesive

Apr 20, 2015 | Engineered Material Systems is pleased to debut its 535-11M-7 UV cured epoxy. 535-11M-7 was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications.

Engineered Materials Systems Debuts Low-Cost Conductive Adhesive for Stringing or Shingling Solar Modules

Feb 28, 2015 | Engineered Materials Systems introduces its new DB-1541-S9 Low-Cost Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. DB-1541-S9 is designed to electrically interconnect solar cells using ribbons or direct cell to cell contact.

DB-1541-S9 Low-Cost Conductive Adhesive.

Engineered Material Systems Introduces a New 535-11M-3 UV Cure Adhesive

Jan 27, 2015 | Engineered Material Systems is pleased to debut its 535-11M-3 UV cured epoxy. 535-11M-3 was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications.

Engineered Material Systems Introduces DF-3020 Dry Film Negative Photoresist

Jan 06, 2015 | Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and IC cooling applications, is pleased to introduce the DF-3020 dry-film negative photo resist for use in micro electro mechanical systems (MEMS) and wafer-level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

DF-3020 Dry Film Negative Photoresist.

Engineered Material Systems Sponsors Back Contact Workshop

Oct 30, 2014 | Engineered Material Systems, Inc. (EMS)announces that it is a sponsor for the Back Contact Workshop, scheduled to take place Nov. 13-14, 2014 in Amsterdam, The Netherlands.

Engineered Material Systems to Showcase EMS 561-147 Conductive Adhesive for HIT Modules at the EU PVSEC

Sep 16, 2014 | Engineered Material Systems will introduce its new 561-147 Snap Cure Conductive Adhesive in Hall 1, Booth E19 at EU PVSEC, scheduled to take place Sept. 23-25, 2014 at the RAI Convention & Exhibition Centre in Amsterdam.

EMS 561-147

Rocket EMS Ramps Up Cleaning Capabilities with Three New Aqua Klean Systems  

Sep 09, 2014 | Rocket EMS Inc. today announced that it has installed three new cleaning systems from Aqua Klean Systems. Rocket EMS installed a Typhoon T-8 Chemistry Zero-Discharge Cleaner, T15 Water Soluble Cleaner and DI Recirculating System.

EMS Inc. Installs New Essemtec SMT Line

May 17, 2014 | Essemtec announces that Electronic Manufacturing Solutions, Inc. (EMS, Inc.) recently installed its second SMT line consisting of a Tucano screen printer, Paraquda SMT machine with Jet valve dispenser, conveyors and an upgraded Zonda oven. Additionally, the company is upgrading its original RO400FC reflow oven to a Zonda. This will result in two identical lines for the company, allowing production to be doubled.

Tucano screen printer, Paraquda SMT machine, inspection conveyor, and an RO400FC reflow oven)

Formula E s.r.l. and Engineered Materials Systems, Inc. Enter Collaboration Agreement

May 07, 2014 | Formula E s.r.l., a leading supplier of photovoltaic technology and automated manufacturing lines, and Engineered Materials Systems have entered into an agreement for the development of electrically conductive adhesives for use on Formula E automated manufacturing lines.

Engineered Material Systems Debuts DF-4017 Hydrophobic Dry Film Negative Photoresist

May 05, 2014 | Engineered Material Systems, Inc. (EMS) introduces the DF-4017 Dry Film Negative Photoresist for use in micro-electromechanical systems (MEMS).

Engineered Material Systems Introduces Highly Stretchable/Durable /Creasable Conductive Silver Ink for Wearable Electronics

Apr 15, 2014 | Engineered Material Systemsdebuts the CI-1062 Conductive Silver Ink for circuitry fabrication on wearable substrates.

Engineered Material Systems Introduces 535-10M-49 UV Cure Adhesive

Mar 31, 2014 | Engineered Material Systems debuts its 535-10M-49 UV cured epoxy adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.

Engineered Material Systems Debuts Low-Temperature Cure/Snap Cure Conductive Adhesive for Die-Attach Applications

Feb 11, 2014 | Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.

Engineered Material Systems Introduces New Non-Conductive Paste

Jan 29, 2014 | Engineered Material Systems (EMS) debuts its 585-1 Non-Conductive Paste (NCP) designed for flip chip packaging applications.

Engineered Material Systems Introduces 535-10M-45 UV Adhesive for Microelectronic Assembly Applications

Jan 09, 2014 | Engineered Material Systems is pleased to debut its 535-10M-45 UV Cured Epoxy Adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.

Engineered Material Systems Introduces Low-Cost, Snap Cure Conductive Adhesive for Die Attach Applications

Jan 07, 2014 | Engineered Material Systems debuts its CA-175 Low Cost, Snap Cure Conductive Adhesive designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics or camera modules.

Engineered Material Systems Introduces DF-3020 Antimony Free Dry Film Negative Photoresist

Oct 29, 2013 | Engineered Material Systems, Inc., is pleased to introduce the DF-3020 Dry Film Negative Photoresist for use in micro-electro-mechanical systems (MEMS).

 DF-3020 Dry Film Negative Photoresist

Engineered Material Systems Introduces Low-Cost Conductive Adhesive for Die Attach Applications

Oct 22, 2013 | Engineered Material Systems debuts its CA-165 Low-Cost Conductive Adhesive designed for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules.

Engineered Materials Systems Debuts DF-2000 Series Dry Film Negative Photoresist at IWLPC

Oct 04, 2013 | Engineered Material Systems Inc will showcase its DF-2000 Series Dry Film Negative Photoresists in booth #14 at the International Wafer Level Packaging Conference (IWLPC), scheduled to take place November 6-7, 2013 at the Doubletree Hotel in San Jose, Calif.

DF-2000 Series Dry Film Negative Photoresist

Engineered Material Systems Releases New Conductive Adhesive for Solder Replacement Applications

Sep 24, 2013 | Engineered Material Systems debuts its CA-102 Conductive Adhesive designed for bonding components to circuit boards.

 CA-102 Conductive Adhesive

Engineered Material Systems Debuts DB-1588-3 Low Cost Conductive Adhesive at EU PVSEC 2013

Sep 10, 2013 | Engineered Material Systemswill introduce its DB-1588-3 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in Hall 2, stand E6 at the 28th European Photovoltaic Solar Energy Conference scheduled to take place October 1-3, 2013 at Parc des Expositions Paris Nord Villipinte in Paris, France.

New High Thermal Conductivity LED Die Attach Adhesive for Small Die and LEDs from Engineered Material Systems

Sep 05, 2013 | Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.

Engineered Material Systems Introduces Low-Cost Jettable Conductive Adhesive for Photovoltaic Stringing and Bussing Applications

Jun 24, 2013 | Engineered Material Systems (EMS), debuts its CA-148 Jettable Conductive Adhesive for ribbon stringing and bussing in photovoltaic applications.

Engineered Material Systems Develops NR-2500 Spin Coatable Negative I-Line Photoresist

Jun 14, 2013 | Engineered Material Systems, Inc., introduces NR-2500 Liquid Negative Photoresist for use in micro-electromechanical systems (MEMS).

Engineered Material Systems Introduces New Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive

Jun 12, 2013 | Engineered Material Systems, announces the debut of its 357-284 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.

Engineered Material Systems Introduces 535-18M-57 UV Cure Adhesive for Disk Drive, Camera Module, Optoelectronic and Circuit Assembly Applications

May 22, 2013 | Engineered Material Systems, Inc. (EMS) debuts its 535-18M-57 UV Cured Epoxy Adhesive formulated for microelectronic assembly applications.

A New Low-Cost Conductive LED Die Attach Adhesive Is Now Available for Small Die and LEDs

Apr 29, 2013 | Engineered Material Systems debuts its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.

Engineered Material Systems to Debut Low-Cost Conductive Adhesive for Back Contact Solar Modules at SNEC 2013

Apr 25, 2013 | Engineered Material Systems will debut its new DB-1588-2 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in booth #W3-688 at the 2013 SNEC 7th International Photovoltaic Power Generation Conference & Exhibition, scheduled to take place May 14-16, 2013 at the Shanghai New International Expo Center in China.

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