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News Releases from Nordson MARCH

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14 news releases added by Nordson MARCH

Company Information:

Nordson MARCH

Nordson MARCH is the global leader in plasma cleaning equipment and plasma applications technology. The company has designed and manufactured plasma equipment for more than 30 years.

Concord, California, USA

Cleaning, Component Preparation, Manufacturer of Assembly Equipment, OEM, Repair/Rework

  • Phone 925.827.1240
  • Fax 925.827.1189

Nordson MARCH website

Company Postings:

(8) products in the catalog

(2) technical library articles

(14) news releases

Nordson MARCH Introduces the new-generation RollVIA plasma system for roll-to-roll production in PCB manufacturing operations Completely Self-Contained with Integrated Pump Package

Nov 29, 2017 | Nordson MARCH announces its new-generation RollVIA™ plasma system, a completely self-contained vacuum plasma system with production-proven, roll-to-roll material handling for flexible printed circuit board (PCB) manufacturing. The new RollVIA incorporates unique vacuum and gas flow technology, new process control technology, updated electrode designs, and superior temperature management with precise control of roll speed, tension, and edge guidance for uniform plasma treatment of substrates as thin as 25 microns. The RollVIA system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during production of PCBs.

RollVIA™ plasma system.

Nordson MARCH Will be Ready to Discuss Plasma Technologies at Productronica 2017

Nov 08, 2017 | Nordson MARCH will be ready to discuss plasma technologies for printed circuit board, microelectronics, and semiconductor packaging in stand A2.345/445 at Productronica, the world’s leading trade fair for electronics development and production, to be held in Munich, Germany, November 14-17, 2017.

Nordson MARCH Presents Paper at SMTA Guadalajara on Enhancing Performance of PCBAs Using Plasma Treatment

Oct 05, 2017 | Nordson MARCH will present the paper, Enhancing the Performance of Printed Circuit Board Assemblies Using Plasma Treatment, at SMTA Guadalajara 2017. David Foote, Global Applications Manager, Nordson MARCH, will discuss the fundamentals of plasma treatment. Specific applications and examples will be shown to demonstrate the many uses and benefits of plasma processing for printed circuit board assemblies (PCBAs), including managing electrostatic discharge (ESD) damage.

Revolutionary AOI, AXI and & Bondtesting from Nordson at NEPCON South China

Aug 03, 2017 | Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. Test and inspection solutions from Nordson DAGE, Nordson MATRIX and Nordson YESTECH will be demonstrated at the event.

X2.5# system.

Nordson MARCH Wins 2017 New Product Introduction Award for its ModVIA Plasma System

Mar 07, 2017 | Nordson MARCH has won the 2017 New Product Introduction (NPI) Award in the Surface Treatment Equipment category for its ModVIA™ Plasma Treatment System. The Award, sponsored by Printed Circuit Design and Fab magazine, was presented at a ceremony during IPC APEX 2017, held in San Diego, CA, on February 14, 2017.

ModVIA Plasma System.

Nordson MARCH's New Plasma Polymerization Deposition Systems Deposit Materials During Precision Manufacturing Processes

Feb 07, 2017 | Nordson MARCH introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surface characteristics of a substrate. Plasma deposition can be used for applications in a wide range of industries, including medical, life sciences, industrial, semiconductor, MEMS, plastics, and electronics.

PD Series Plasma.

Nordson MARCH Receives Global Technology Award for FlexTRAK-CDS High-volume Plasma System

Oct 11, 2016 | Nordson MARCH received the 2016 Global Technology Award for its FlexTRAK®-CDS high-volume plasma system at a ceremony held in conjunction with the SMTA International conference in Rosemont, IL on September 27, 2016. The system removes contamination, etches surfaces to improve adhesion, and provides surface activation prior to die attach, wire bond, mold encapsulation, and underfill to lead frame strips, laminated substrates, and other strip-type electronic components.

Joe Stockunas, vice president, Advanced Technology, Nordson Corporation, accepts award.

Nordson MARCH's Plasma Confinement Ring Increases Etch Rate and Improves Treatment Uniformity for Wafer Processing

Sep 21, 2016 | Nordson MARCH introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.

Plasma Confinement Ring.

Nordson MARCH Research Evaluates the Effects of RF Plasma Processing Prior to Conformal Coating on Adhesion, Conformity of Coverage, and Electrical Functionality

Mar 03, 2016 | Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). The paper can be downloaded at

Nordson MARCH StratoSPHERE Plasma Treatment System Expands Up to 6 Chambers for Increased Throughput and Flexibility

Aug 20, 2015 | Nordson MARCH announces that its StratoSPHERE™ Series plasma treatment equipment for wafer-level packaging and 3D packaging applications can now be configured in two, four, and even six chamber configurations for increased throughput and flexibility. The SPHERE™ plasma systems provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations, especially for applications such as 2.5D and 3D wafer-level fan-out.

StratoSPHERE Plasma Treatment System.

Nordson MARCH Introduces the SPHERE Series Plasma Treatment Systems for Semiconductor Applications

Jul 01, 2015 | Nordson MARCH, a Nordson company (NASDAQ: NDSN)announces its new SPHERE™ Series plasma systems for wafer-level and 3D packaging applications. Based on Nordson MARCH's TRAK™ Series, the new series consists of the TrophoSPHERE™ and StratoSPHERE™ plasma treatment systems. The systems perform descum, ashing (photoresist/polymer stripping), dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Both systems support automated handling and processing of round or square wafers and can process thin wafers with or without a carrier, depending upon the wafer thickness.

SPHERE™ Series plasma systems for wafer-level and 3D packaging applications.

Nordson MARCH MaxVIA System Offers Superior PCB Plasma Treatment Uniformity for Varied Panel Sizes and Types

Jun 07, 2011 | Nordson MARCH announces the global availability of the MaxVIA™ plasma treatment system that streamlines the printed circuit board (PCB) manufacturing process by quickly and uniformly treating a variety of panel sizes and types.

Nordson MARCH's MaxVIA™ System is specifically configured to meet the demands of today’s high throughput PCB manufacturing operations. Plasma treatment uniformity is a key operational feature in desmear and etchback applications for HDI, flexible and rigid circuit board manufacturing technologies.

FlexTRAK-WR Plasma System nominated for 2007 Editors' Choice Best Product Award from Semiconductor International Magazine.

Jul 16, 2007 | March Plasma Systems has nominated its advanced wafer processing plasma system, the FlexTRAK-WR system, for the prestigious 2007 Editors' Choice Best Product Award sponsored by Semiconductor International magazine.

The FlexTRAK™-WR system is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter. The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Its three-axis symmetrical chamber ensures all areas of the wafer are treated uniformly, while tight control over all process parameters ensures highly repeatable results.

March Plasma Systems Receives Purchase Order for FlexTRAK-WR 200 mm Wafer Processing System

Apr 23, 2007 | March Plasma Systems has received a firm purchase order for a FlexTRAK-WR wafer processing system from a major semiconductor manufacturing company.

FlexTRAK-WR 200 Wafer Processing System.
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2-Part Mixing Pump