News Releases from Engineered Conductive Materials, LLC
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19 news releases added by Engineered Conductive Materials, LLC
Company Information:
Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small- to Medium-Size Chip Bonding
Nov 15, 2016 | Engineered Materials Systems today announced its new EMS 561-854 Fast Cure Conductive Adhesive for die-attach applications with small- to medium-size die and tantalum capacitors. EMS 561-854 is designed to cure in one minute at 170ºC.
Engineered Material Systems to Showcase Liquid and Dry Film Negative tone Photoresists at Semicon Europa
Oct 06, 2016 | Engineered Material Systems will exhibit at Semicon Europa, scheduled to take place Oct. 25-27, 2016 in Grenoble, France. Company representatives will showcase both liquid and dry-film negative photoresist for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation). These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry film) and processing on MEMS and IC wafers.
Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next Generation Solar Modules at Intersolar/EU PVSEC
May 09, 2016 | Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at the Intersolar/EU PVSEC show, scheduled to take place June 23-25, 2016 in Munich. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
Engineered Material Systems to Show Its New Conductive Adhesive for Stringing HIT and Multi Bus Bar Solar Modules at EU PVSEC
Aug 23, 2015 | Engineered Material Systems, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar silicon solar modules.
Engineered Material Systems Introduces Die Attach for Temperature-Sensitive Applications
Feb 26, 2013 | Engineered Material Systems debuts its DB-1568-1 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices.
Engineered Material Systems Introduces New Low-Temperature Cure Die Attach
Jan 21, 2013 | Engineered Material Systems debuts its 561-50 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices
Engineered Conductive Materials Introduces Low-Cost, Flexible Conductive Adhesive CA-141
Dec 04, 2012 | Engineered Conductive Materialsintroduces the fast curing CA-141 Conductive Adhesive for stringing and bussing next-generation CIGS solar modules.
Engineered Conductive Materials to Discuss New ECA Technology at the 8th CSPV Workshop in Shanghai
Nov 27, 2012 | Engineered Conductive Materials, LLC,, will present “Conductive Adhesives for Back Contact Solar Modules” during the upcoming China Solar Grade Silicon and PV Power Conference (CSPV), scheduled to take place December 6-8, 2012 at the Shanghai Nan Jiao Hotel in Shanghai, China.
Rocket EMS Awarded ISO 13485:2003 Certification
Nov 27, 2012 | Rocket EMS Inc has achieved ISO 13485:2003 certification. This internationally recognized standard acknowledges the suitability of the company’s quality management system for the design and manufacture of medical devices.
Engineered Conductive Materials’ Chief Technical Officer to Discuss New ECA Technology at the MWT Back Contact Workshop in Amsterdam
Nov 02, 2012 | Engineered Conductive Materials, announces that Rich Wells will present “Conductive Adhesives for Back Contact Solar Modules” during the upcoming MWT Workshop, scheduled to take place November 20-21, 2012 at the Nemo Center in Amsterdam, The Netherlands.
Engineered Conductive Materials introduces DB-1588 Low Cost Conductive Adhesive for Back Contact Solar Modules
Nov 08, 2011 | Engineered Conductive Materials introduces its DB-1588 low-cost conductive adhesive for back contact applications in crystalline silicon solar modules.
Keith Margolin Joins Engineered Conductive Materials as Formulation Chemist
Sep 06, 2011 | Engineered Conductive Materials, LLC has appointed Keith Margolin as Formulation Chemist in its Research and Development (R&D) group.
Engineered Conductive Materials Introduces Fast Cure Conductive Adhesive for Back Contact Solar Modules
Aug 29, 2011 | Engineered Conductive Materials debuts its DB-1580 Series Conductive Stringer Attach Adhesives for back contact applications in crystalline silicon solar modules.
Engineered Conductive Materials to Debut Conductive Adhesives for Back Contact Solar Modules at PVSEC 2011
Aug 08, 2011 | Engineered Conductive Materials, LLC will introduce its new line of conductive adhesives for back contact solar module applications in Hall A1, Stand B4 at the upcoming European Photovoltaic Solar Energy Conference and Exhibition (PVSEC), scheduled to take place September 5-8, 2011 at the CCH Congress Centre and International Fair in Hamburg, Germany.
Engineered Conductive Materials Appoints EMJS Tech, Inc. to Represent Its Sol-Ag Line of Conductive Adhesives and Grid Inks in Korea
Jul 13, 2011 | Engineered Conductive Materials announces that EMJS Tech, Inc. will represent its Sol-Ag line of conductive adhesives and grid inks throughout Korea.
Engineered Conductive Materials Debuts DB-1538-2 Ribbon Attach Conductive Adhesive
Jul 06, 2011 | Engineered Conductive Materials introduces its DB-1538-2 Conductive Stringer Attach Adhesive, which is designed for use in thin-film, organic and thinned silicon solar modules.
Engineered Conductive Materials’ Chief Technical Officer to Discuss New ECA Technology at Intersolar North America 2011
Jun 13, 2011 | Engineered Conductive Materials, LLC announces that Rich Wells will present “Cost Reduction with High Performance Conductive Adhesives for Cell Interconnects” during the Innovation Exchange at the upcoming Intersolar North America, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.
Engineered Conductive Materials to Exhibit DB-1541-X Series Adhesives at Intersolar Europe 2011
Mar 31, 2011 | Engineered Conductive Materials, LLC will showcase its DB-1541-X Series Conductive Stringer Attach Adhesives in Hall A5, Stand 653 at the upcoming Intersolar Europe, scheduled to take place June 8-10, 2011 at the New Munich Trade Faire Centre in Munich, Germany.
Engineered Conductive Materials to Exhibit DB-1541-X Series Adhesives at SNEC 2011
Jan 17, 2011 | Engineered Conductive Materials, LLC, will showcase its DB-1541-X Series Conductive Stringer Attach Adhesives in Hall E7, Stand 655 at the upcoming SNEC International Photovoltaic Power Generation Conference & Exhibition, scheduled to take place February 22-24, 2011 at the Shanghai New International Expo Center in Shanghai, China.
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