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News Releases from iNEMI (International Electronics Manufacturing Initiative)

Read iNEMI (International Electronics Manufacturing Initiative) company news


21 news releases added by iNEMI (International Electronics Manufacturing Initiative)

Company Information:

iNEMI (International Electronics Manufacturing Initiative)

iNEMI is an industry-led consortium focused on identifying and closing technology gaps, which includes the development and integration of the electronics industry supply infrastructure.

Herndon, Virginia, USA

  • Phone 703-834-0330
  • Fax 703-834-2735

iNEMI (International Electronics Manufacturing Initiative) website

Company Postings:

(2) technical library articles

(21) news releases

iNEMI Publishes White Paper Proposing a Methodology to Determine Risk of Counterfeit Use

Jun 07, 2013 | The Counterfeit Components Project of the International Electronics Manufacturing Initiative (iNEMI) today released a whitepaper entitled, "Development of a Methodology to Determine Risk of Counterfeit Use."

iNEMI Webinar Will Share Tools Developed to Assess Risk of Counterfeit Components

May 23, 2013 | The Counterfeit Components Assessment Project of the International Electronics Manufacturing Initiative (iNEMI) will hold two open webinars to help the electronics manufacturing supply chain better manage their risk of counterfeit components.

iNEMI Publishes its Tenth Roadmap

May 14, 2013 | Cloud computing, sustainability & recycling, and the explosive growth of MEMS & sensors are among leading trends

The 2013 iNEMI Roadmap is provided on a USB drive.

iNEMI Survey Asks about Boundary Scan Adoption

Feb 06, 2009 | Input will help the electronics industry improve test implementation and coverage

iNEMI Roadmap Workshop

Apr 23, 2008 | European workshop scheduled for 18 June at IMEC in Leuven, Belgium

iNEMI Schedules Regional Roadmap Workshops

Mar 24, 2008 | North American workshop is May 14

iNEMI Names Grace O�Malley Manager of Operations for Europe

Nov 13, 2007 | Photo available (see note at end of release)

Grace O'Malley, iNEMI Manager of Operations-Europe

Wiley-IEEE Press Publishes iNEMI Lead-Free Book

Nov 02, 2007 | Book provides in-depth information for implementing

iNEMI Previews Highlights of 2007 Roadmap at IPC Printed Circuits Expo, APEX and Designers Summit

Jan 15, 2007 | Forum on lead-free processes and summit on reliability are also planned

iNEMI Organizes Task Group to Address Availability of SnPb BGAs

Nov 08, 2006 | Workshop Scheduled for January 24 in Silicon Valley

"Life after EU RoHS" Forum Scheduled for September 28

Sep 08, 2006 | iNEMI and IPC sponsor event to discuss emerging environmental regulations

iNEMI Schedules Meetings at SMTAI

Sep 07, 2006 | A broad range of topics will be covered

iNEMI Publishes Guidelines for Subassemblies in High-Reliability Applications

Jun 23, 2006 | Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

May 04, 2006 | Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

May 04, 2006 | Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

May 04, 2006 | Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products

Third Annual Tin Whisker Workshop Scheduled for May 30 at ECTC

Apr 17, 2006 | Event co-sponsored by iNEMI, the IEEE CPMT Society and ECTC

iNEMI Kicks Off Roadmap

Jan 18, 2006 | Open meeting at APEX 06

iNEMI Sponsors RFID Forum

Sep 07, 2005 | Sun Microsystems to Host Oct 4 Meeting

Congressman Frank Wolf to Open iNEMI Innovation Leadership Forum

Aug 31, 2005 | EIA and SIA Co-Sponsor the Event

NEMI Seeks Broad Electronics Industry Participation in Data Exchange Convergence Project

Jan 24, 2001 | The NEMI issued an industry-wide call for participation for a new project the organization is proposing to accelerate the convergence of competing approaches for CAD data exchange formats used by the electronics industry. Through this project, industry participants will leverage the strengths of existing standards (i.e., GenCAM, IPC-2578) and solutions (i.e., ODB++) to recommend a common course of action for future standards work through the well-established process of IPC.

thermal process software

Jetting Pump for Integration