Kester News

Kester’s Peter Biocca to Chair AOI and X-Ray Inspection Technical Session at SMTAI 2010

Oct 04, 2010 | Kester announces that Peter Biocca, Senior Market Development Engineer, will Co-Chair Session PRC2, titled “Strategies for Optimizing AOI and X-Ray Inspection” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The session will take place Wednesday, October 27, 2010 from 10:30 a.m.-12 p.m. in room Europe 1.

Kester Receives ISO 9001:2008 Certification

Mar 26, 2010 | ITASCA, IL - Kester announces that its facility in Itasca, IL has received a certificate of registration for the International Standard AS9120:2002-10, ISO 9001:2008.

Kester to Showcase NXG1 No-Clean Paste at SMTA Atlanta Expo & Tech Forum

Mar 24, 2010 | ITASCA, IL - Kester announces that representative Gardner & Meredith will showcase its NXG1-HF, a lead-free no-clean solder paste, at the upcoming SMTA Atlanta Expo and Tech Forum, scheduled to take place Thursday, April 15, 2010 at the Gwinnett Civic Center in Duluth, GA.

Kester to Host Solder Alloy Task Group at IPC Midwest 2009

Aug 27, 2009 | ITASCA, IL — August 2009 — Kester announces that David Scheiner will host a Solder Alloy Task Group at the upcoming IPC Midwest Conference. The meeting will be held during Session 5-24c of the Standards Development Meetings, scheduled to take place Tuesday, September 22, 2009 from 1:30- 3 p.m.

Kester Appoints Experienced Technology Manager to Solder Paste R&D

Jul 28, 2009 | ITASCA, IL — July 2009 — Kester is pleased to announce appointment of Adrian Hawkins, Ph.D., to the role of Technology and Development Manager. Adrian’s primary responsibility will be to lead the Research & Development for Solder Paste in North America.

Kester Announces Approval of FL250D No-Clean Paste by Leading Network Equipment Company

May 01, 2009 | ITASCA, IL � April 2009 � Kester announces that its FL250D no-clean solder paste has been added to the global approved materials list of a leading network equipment company due to its excellent properties in terms of eliminating/preventing head-in-pillow defects.

Kester's Peter Biocca to Present at SMTA Atlanta 2009

Apr 13, 2009 | ITASCA, IL � April 2009 � Kester's Peter Biocca, along with Carlos Rivas of SMT Dynamics, will present a paper titled, �Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level,� at the upcoming 13th Annual Atlanta Expo scheduled to take place at 1 p.m. on Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.

Kester to Exhibit Leading Fluxes, Pastes and Wires at SMTA Atlanta

Apr 13, 2009 | ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.

Kester Successfully Completes Headquarters Expansion Project

Mar 18, 2009 | ITASCA, IL � March 2009 � Kester announces that it recently completed an expansion project at its Itasca, IL headquarters facility to dedicate more floor space to Solder Paste and Tacky Soldering Flux products.

Kester's David Scheiner to Hold Task Group at APEX 2009

Mar 06, 2009 | ITASCA, IL � March 2009 � Kester is proud to announce that David Scheiner will hold a Solder Alloy Task Group at the upcoming APEX Conference and Exhibition, during Session 5-24c of the Standards Development Meetings, scheduled to take place on Monday, March 30, from 1:30-3 p.m.