SUPPLIER: LEL Tech
Agilent SP50 Series II
Agilent SP50 Series II has been sold
Model: |
Agilent SP50 Series II |
Category: |
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Model Year: |
2006 |
Condition: |
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Location: |
Texas, USA |
Offered by: |
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| Contact Supplier |
Agilent SP50 Series II 3D SPI
3D Solder Paste Inspection System
Model: SP50 Series II
Vintage: 2006
Maximum board size: 510 by 510 mm (20 by 20 in)
Minimum board size: 50 by 50 mm (1.97 by 1.97 in)
Maximum board thickness: 4 mm (0.16 in)
2D and 3D solder paste Volume, area, height, XY offset, bridge measurement detection
3D image acquisition using laser triangulation, image processing using blob analysis
Supports Agilent’s proprietary SPC packages with reporting and alarming capability, complete with text output files
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