Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift

Published:

September 7, 2017

Author:

Young K. Song and Vanja Bukva

Abstract:

As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized....

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Company Information:

Teledyne DALSA

Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services.

Waterloo, Ontario, Canada

Other

  • Phone 519-886-6000

Teledyne DALSA website

Company Postings:

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