Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders
Published: |
February 16, 2017 |
Author: |
Thomas Sanders, Sivasubramanian Thirugnanasambandam and John Evans, Ph.D., Michael Bozack, Ph.D., Jeff Suhling, Ph.D. - Auburn University, Wayne Johnson, Ph.D. - Tennessee Tech University |
Abstract: |
This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate. This paper was originally published by SMTA in the Proceedings of SMTA International.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Auburn University »
- Sep 26, 2023 - Analysis of the Mechanical Behavior, Microstructure, and Reliability of Mixed Formulation Solder Joints
- Jun 14, 2023 - The Effects of Silver Content and Solidification Profile on the Anand Constitutive Model for SAC Lead Free Solders
- Oct 31, 2022 - Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components
- Oct 31, 2022 - Surfaces of mixed formulation solder alloys at melting
- Oct 11, 2022 - ASSESSMENT OF ACCRUED THERMO-MECHANICAL DAMAGE IN LEADFREE PARTS DURING FIELD-EXPOSURE TO MULTIPLE ENVIRONMENTS
- See all SMT / PCB technical articles from Auburn University »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders article has been viewed 1084 times
