Imbedded Component/Die Technology (IC/DT®)

Published:

February 26, 2009

Author:

Mark McMeen.

Abstract:

STI has developed a patented1 packaging technology coined Imbedded Component/Die Technology (IC/DT®) to integrate multiple subsystems within an electronics assembly into a single, advanced, high-density assembly. Imbedded Component/Die Technology (IC/DT®) enables the manufacturing and assembly of smaller, lighter, and more technologically advanced high density CCAs through imbedding unpackaged components in a 3-D laminate substrate with integrated thermal management...

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Company Information:

STI Electronics

Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry.

Madison, Alabama, USA

Assembly, Contract Manufacturer, Design, IPC Standards Certification Center, Training Provider

  • Phone 256-461-9191
  • Fax 256-461-7524

STI Electronics website

Company Postings:

(19) products in the catalog

(75) upcoming training courses

(1) technical library article

(235) news releases

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