Implementing Warpage Management: A Five-Step Process for EMS Providers

Published:

August 19, 2014

Author:

Ken Chiavone

Abstract:

Warpage management consists of planning, measuring, analyzing, sharing, and reacting to data related to the surface shapes of electronics components as they change throughout the reflow assembly process. Leading semiconductor manufacturers have had warpage management systems in place for ten years or more, mainly because microchip package warpage must be understood and compensated for in order to attain high assembly yields. Similarly, newer device architectures such as package-on-package and system-on-a-chip are sensitive to warpage-related assembly issues, and companies involved in the manufacture and assembly of these devices tend to have the most advanced warpage management programs....

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Company Information:

Leading provider of full-field metrology solutions for substrates and packages in the OEM/CEM/SATS/PCB segments of the microelectronics industry.

Atlanta, Georgia, USA

Consultant / Service Provider, Manufacturer

  • Phone 404-486-0880
  • Fax 404-486-0890

See Company Website »

Company Postings:

(6) products in the catalog

(5) technical library articles

(25) news releases

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