Effect of Contact Time on Lead-Free Wave Soldering

Published:

August 28, 2008

Author:

Jim Morris, Richard Szymanowski

Abstract:

The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave....

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Company Information:

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Manufacturer

  • Phone 5085414749
  • Fax 5085202288

See Company Website »

Company Postings:

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