FCT Assembly Solves Bridging Issues at Reflow

Published:

April 9, 2012

Author:

FCT Assembly

Abstract:

As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasi...

  • Download FCT Assembly Solves Bridging Issues at Reflow article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

FCT ASSEMBLY, INC.

With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.

Greeley, Colorado, USA

Manufacturer of Assembly Material, Soldering

  • Phone 970-346-8002
  • Fax 970-346-8331

FCT ASSEMBLY, INC. website

Company Postings:

(14) products in the catalog

(5) technical library articles

(176) news releases

  • Jul 27, 2017 - Electrochemical Methods to Measure the Corrosion Potential of Flux Residues | KYZEN Corporation
  • Jul 21, 2017 - How to calibrate JUKI CF feeder | ZK Electronic Technology Co., Limited
  • Jun 01, 2017 - Evaluating the Effects of Plasma Treatment prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of Coverage | Nordson MARCH
  • Mar 30, 2017 - Multiple Methods for Applying Paste Flux or Solder Paste for BGA Rework | BEST Inc.
  • Feb 01, 2017 - BGA Rework Process | BEST Inc.
  • Browse Technical Library »

FCT Assembly Solves Bridging Issues at Reflow article has been viewed 1313 times

reflow oven profiler

Reflow Oven