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Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

Published:

September 16, 2010

Author:

Evstatin Krastev, David Bernard

Abstract:

With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and de...

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Company Information:

Nordson DAGE

The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Aylesbury. Buckinghamshire, United Kingdom

Inspection, Test Services

  • Phone +44 (0) 1296 317800
  • Fax +44 (0) 1296 317801

Nordson DAGE website

Company Postings:

(11) products in the catalog

(1) technical library article

(116) news releases

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