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Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate

Published:

November 8, 2017

Author:

Viktoria Rawinski

Abstract:

Due to the ongoing trend towards miniaturization of power components, the need for increased thermal conductivity of solder joints in SMT processes gains more and more importance. Therefore, the role of void free solder joints in power electronics becomes more central. Voids developed during soldering reduce the actual thermal transfer and can cause thermal damage of the power components up to their failure. For this reason, the company has developed a new technique to minimize the formation of these voids during the soldering process....

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Company Information:

kurtz ersa Corporation

Manufacturer of Selective Soldering Systems, Ersascope BGA Inspection Systems, BGA Rework Systems, Soldering Irons, Wave Solder and Reflow Equipment.

Wertheim, Germany

Manufacturer of Assembly Equipment, Selective Soldering, Soldering

  • Phone +49 (0) 93 42 / 80 00
  • Fax +49 (0) 93 42 / 80 01 00

kurtz ersa Corporation website

Company Postings:

(15) products in the catalog

(1) technical library article

(192) news releases

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