Design and Process Development for the Assembly of 01005 Passive Components

Published:

March 5, 2018

Author:

J. Li, S. Poranki, K. Srihari - Watson Institute for Systems Excellence, R. Gallardo, M. Abtew, R. Kinyanjui - Sanmina-SCI Corporation

Abstract:

Growing demands for smaller electronic assemblies has resulted in reduced sizes of passive components, requiring the introduction of newer components, such as the 01005 devices. Component miniaturization presents significant challenges to the traditional surface mount assembly process. A successful assembly solution for these 01005 devices should be repeatable and reproducible, and should include guidelines for (i) the selection of solder paste and (ii) appropriate stencil and substrate pad design, and should ensure strict process control standards....

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Company Information:

Sanmina-SCI

Sanmina-SCI is a tier 1 provider of EMS and PWB along with vertically integrated capabilities from design through qualification.

San Jose, California, USA

  • Phone 408-964-3100

Sanmina-SCI website

Company Postings:

(2) technical library articles

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