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The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies

Published:

January 8, 2015

Author:

Richard Coyle, Richard Popowich, Debra Fleming, Peter Read - Alcatel Lucent, Raiyo Aspandiar, Vasu Vasudevan, Steve Tisdale - Intel Corporation, Iulia Muntele - Sanmina Corporation.

Abstract:

Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption.

Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern...

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Company Information:

Sanmina-SCI

Sanmina-SCI is a tier 1 provider of EMS and PWB along with vertically integrated capabilities from design through qualification.

San Jose, California, USA

  • Phone 408-964-3100

Sanmina-SCI website

Company Postings:

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